Bonding-Layer Substrate Structure for High-Aspect-Ratio Interconnects
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Solution Overview
Problem
Current substrate structures face challenges in forming conductive materials within high aspect ratio openings, leading to adverse effects on electrical performance and reduced product reliability.
Innovation Solution
A substrate structure is manufactured by confining conductive paste within openings using a bonding layer, allowing direct contact between conductive members and core layers, and bonding substrates through a heating and pressing process, which addresses stress issues and uneven surface height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive materials are formed within high aspect ratio openings, then electrical connections can be established, but manufacturing reliability deteriorates due to inability to reliably form conductive materials
Solution Approach 1:
The patent introduces a bonding layer as an intermediary component between the conductive paste and the conductive member. This bonding layer has a gradient structure with different material compositions at different depths, serving as a transition medium that facilitates reliable conductive material formation in high aspect ratio openings. The bonding layer mediates between the paste and the metal surface, enabling controlled material deposition and improving manufacturing reliability.
Solution Approach 2:
The patent employs parameter changes by creating a gradient structure in the bonding layer where material composition, density, or porosity varies continuously from the top surface to the bottom. This gradual parameter change allows for controlled interaction between the conductive paste and the underlying conductive member, enabling reliable material formation even in high aspect ratio openings where uniform parameters would fail.
2Strength
If direct metal-to-metal bonding is used, then bonding strength is improved, but uneven surface height issues worsen
Solution Approach 1:
The bonding layer serves as an intermediary between metal surfaces, maintaining direct metal-to-metal contact for strength while compensating for surface height variations. The layer's graded structure allows it to conform to uneven surfaces while still enabling strong bonding, thus resolving the contradiction between bonding strength and surface uniformity.
Solution Approach 2:
The bonding layer exhibits local quality through its gradient structure, where different regions have different material properties optimized for their specific functions. The top region may be more compliant for surface accommodation, while the bottom region provides strong bonding, allowing the system to achieve both strength and surface height uniformity through spatially varying properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances product reliability by improving electrical performance and overcoming uneven surface height issues, while ensuring stable electrical connections.
Implementation Method 1
bond the first substrate and the second substrate by a first heating process and a first pressing process
Implementation Method 2
bond the first substrate and the second substrate by a first heating process and a first pressing process
Data Source
AI summary
A substrate structure includes a first substrate, a second substrate, a first conductive paste, and a first bonding layer. The first substrate includes a first core layer and a first conductive member. The second substrate includes a second core layer and a second conductive member. The first bonding layer confines the first conductive paste between the first conductive member and the second conductive member, such that the first conductive paste is in direct contact with the first conductive member and the second conductive member respectively, and the first bonding layer is in direct contact with the first core layer and the second core layer respectively. A manufacturing method of a substrate structure is also provided.