Bonding Line Defect Detection Circuit for Crack Screening
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Solution Overview
Problem
Existing semiconductor devices face challenges in detecting cracks during the cutting and packaging processes, leading to the release of defective products.
Innovation Solution
Incorporation of defect detection circuits in semiconductor devices that include input and output terminals connected to bonding lines, allowing for the detection of defects through test currents during a test operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If defect detection circuits are added to detect cracks in bonding lines, then product quality and reliability improve, but device complexity and manufacturing cost increase
Solution Approach 1:
The bonding lines are designed to serve dual purposes: functioning as electrical connection paths during normal operation and as test paths for defect detection during testing. The same bonding lines that connect upper and lower structures for signal transmission are also used to carry test currents for crack detection, eliminating the need for separate dedicated test structures.
Solution Approach 2:
The bonding lines themselves are utilized as the test paths for defect detection, meaning the existing structural elements serve the additional function of self-testing. By routing test currents through the same bonding lines that are being tested, the system uses its own infrastructure for quality verification without requiring external or separate testing mechanisms.
2Manufacturing precision
If defect detection circuits are integrated into the semiconductor device, then manufacturing precision and quality control improve, but ease of manufacture deteriorates due to additional process steps
Solution Approach 1:
The defect detection capability is built into the device structure during the initial fabrication process. The bonding lines are designed with test access points and configurations that enable future testing without requiring additional manufacturing steps. This preliminary integration of test functionality into the standard fabrication flow allows for easy incorporation of defect detection capabilities.
3Loss of time
If bonding lines are used as test paths for defect detection, then loss of time in testing is reduced, but difficulty of detecting and measuring increases due to signal interference from normal operation
Solution Approach 1:
The testing operation is performed as a periodic or discrete action at specific stages (such as after bonding but before final packaging), separating the test current flow from normal operational current flow. This temporal separation allows for accurate measurement of test signals without interference from operational signals, as the device is in a known test state rather than an active operational state.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise detection of defects in the bonding lines, reducing the release of defective semiconductor products and improving the overall quality of semiconductor devices.
Implementation Method 1
a first defect detection circuit including an input terminal connected to a lower line, among the plurality of lower lines, and an output terminal connected to another lower line, among the plurality of lower lines
Data Source
AI summary
There is provided a semiconductor device having a defect detection circuit. The semiconductor device includes a plurality of upper bonding pads, a plurality of lower bonding pads adhered to the plurality of upper bonding pads, a first upper line electrically connecting upper bonding pads, among the plurality of upper bonding pads, to each other; a plurality of lower lines electrically connected to the plurality of lower bonding pads; and a first defect detection circuit including an input terminal connected to a lower line, among the plurality of lower lines and an output terminal connected to another lower line, among the plurality of lower lines.