Semiconductor Bonding System with Load Lock Pressure Switching
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Solution Overview
Problem
The existing bonding systems for semiconductor devices face inefficiencies in processing time due to the need to switch between atmospheric and depressurized atmospheres in the surface modifying and transfer processes, leading to prolonged substrate processing times.
Innovation Solution
A bonding system that incorporates a load lock chamber capable of switching between atmospheric and depressurized atmospheres, allowing for the transfer of substrates in a normal pressure atmosphere and modifying them in a depressurized atmosphere, thereby reducing the time required for pressure switching and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the chamber pressure is switched in the surface modifying apparatus to deliver substrates to and from the transfer device, then the substrates can be transferred between atmospheric and depressurized environments, but the processing time is prolonged due to the large chamber volume requiring extended pressure switching time
Solution Approach 1:
The system is divided into two separate functional chambers: a transfer chamber for substrate transfer operations and a modifying chamber for surface modification. The transfer chamber operates in atmospheric pressure while the modifying chamber operates in depressurized atmosphere. This segmentation allows each chamber to be optimized for its specific function without requiring the entire system to switch pressures, thereby reducing pressure switching time and improving processing efficiency.
Solution Approach 2:
A load lock chamber is introduced as an intermediary between the transfer chamber and the modifying chamber. This load lock chamber can switch between atmospheric and depressurized atmospheres, serving as a buffer that allows substrates to be transferred to the modifying chamber without requiring the modifying chamber itself to switch pressures. This intermediary structure enables continuous operation of the modifying chamber while facilitating substrate transfer.
2Reliability
If the surface modifying apparatus operates in a depressurized atmosphere for modification processes, then the modifying process can be performed effectively, but the apparatus requires large chamber volume and frequent pressure switching which reduces productivity
Solution Approach 1:
The system separates transfer operations from modification operations into distinct chambers with different pressure environments. The modifying chamber maintains a stable depressurized atmosphere dedicated to effective surface modification, while the transfer chamber operates in atmospheric pressure for efficient substrate handling. This segmentation eliminates the need for the modifying chamber to switch pressures, thereby improving both modification effectiveness and overall productivity.
Solution Approach 2:
The modifying chamber maintains a continuous depressurized atmosphere throughout the modification process without interruption for pressure switching. Substrates are transferred to this chamber through the load lock system, allowing the modification process to proceed continuously without downtime for pressure transitions, thereby enhancing productivity while maintaining reliable modification effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly shortens the overall processing time for substrates by minimizing the time needed for pressure switching and optimizing the workflow between transfer and modification processes.
Implementation Method 1
a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere
Implementation Method 2
a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force
Data Source
AI summary
A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.