Bonding Machine Horizontal Correction via Distance Measurement

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Solution Overview

Problem

The existing bonding machines fail to maintain the pressing unit and carrier in parallel during the bonding process, leading to uneven pressing force and the occurrence of bonding bubbles between the substrate and carrier, which affects the thickness variation of the bonded wafer.

Innovation Solution

A bonding machine with a horizontal correction function that uses distance measuring units to measure and adjust the level of the pressing unit in real-time, ensuring it remains parallel to the carrier, thereby applying a uniform pressing force and preventing bonding bubbles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the bonding machine uses a pressing unit to press the substrate and carrier layer, then the bonding process can be completed, but the pressing unit and carrier may not remain parallel causing uneven pressing force and bonding bubbles

Engineering Contradiction:

Improvebonding qualityVSAvoidparallel alignment precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent employs distance measuring units to continuously monitor the gap between the pressing unit and carrier, providing real-time feedback on alignment status. This feedback mechanism enables dynamic adjustment of the pressing unit's position to maintain parallel alignment throughout the bonding process, preventing uneven pressing force and bonding bubbles.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent replaces traditional mechanical alignment methods with a combination of optical measurement (distance measuring units) and controlled adjustment mechanisms. This substitution allows for more precise measurement and correction of alignment deviations, ensuring the pressing unit remains parallel to the carrier during bonding.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If the pressing unit applies force to bond the substrate and carrier, then bonding is achieved, but without precise level control bonding bubbles occur in the bonding layer

Engineering Contradiction:

Improvebonding integrityVSAvoidalignment control system

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The distance measuring units provide continuous measurement of the gap between the pressing unit and carrier, creating a feedback loop that enables real-time detection and correction of alignment deviations. This feedback system ensures uniform pressing force distribution, preventing bonding bubbles while maintaining bonding integrity.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent introduces distance measuring units as intermediary devices between the pressing unit and carrier. These intermediaries enable indirect measurement and control of the gap, allowing for precise alignment adjustment without direct mechanical contact that could interfere with the bonding process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If the bonding machine operates without continuous level measurement, then the device structure remains simple, but the total thickness variation of the bonded wafer increases

Engineering Contradiction:

Improvethickness uniformityVSAvoidmeasurement and adjustment system

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The distance measuring units continuously monitor the gap between the pressing unit and carrier, providing feedback that enables real-time correction of alignment deviations. This feedback mechanism ensures uniform pressing force throughout the bonding process, minimizing total thickness variation of the bonded wafer.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent replaces simple mechanical pressing without measurement with a system that uses optical or electromagnetic distance measurement. This substitution enables precise control of the pressing process, ensuring uniform thickness while the adjustment mechanisms correct alignment issues.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures continuous parallel alignment of the pressing unit and carrier, preventing bonding bubbles and improving the uniformity of the bonded substrate thickness, enhancing the accuracy and reliability of the bonding process.

Implementation Method 1

the distance measuring units are disposed on the second chamber, and respectively project a detecting beam onto the pressing unit

Methodology Applied

Scientific EffectLight reflection: Reflection

Data Source

PatentUS20230382071A1Bonding machine with horizontal correction function and horizontal correction method thereof

Publication Date: 2023.11.30 SKYTECH

AI summary

A bonding machine with horizontal correction function includes a first chamber, a second chamber, a pressing unit, a carrier, a plurality of level adjustment units, and a plurality of distance measuring units. The first chamber is configured to be connected to the second chamber to define an enclosed space therebetween. The pressing unit is disposed within the first chamber, and the carrier is disposed within the second chamber. The pressing unit faces the carrier and is configured to press the substrates placed on the carrier. The leveling units are disposed on the first chamber, and the distance measuring units are disposed on the second chamber. Each distance measuring unit is configured to project a detecting beam onto the pressing unit, to measure the level of the pressing unit so as to adjust the level of the pressing unit through the level adjustment unit.