Bonding Machine Alignment Mechanism for Thin Wafer Positioning
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Solution Overview
Problem
The alignment mechanisms of common bonding machines suffer from poor accuracy and low efficiency, which affects the yield and cost-effectiveness of the wafer and carrier substrate bonding process, particularly for thin, fragile wafers prone to warping or breaking during manufacturing.
Innovation Solution
An alignment mechanism for a bonding machine comprising a support pedestal with three first and second alignment members that move parallel to the supporting surface, allowing for precise positioning and alignment of substrates without the need for vertical movement, thereby simplifying the alignment process and improving accuracy and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional alignment mechanisms are used, then the bonding process can be completed, but the alignment accuracy and efficiency are poor
Solution Approach 1:
The alignment mechanism is divided into multiple independent alignment members (first alignment members and second alignment members) that can move independently. Each alignment member can be positioned separately to achieve precise alignment of different regions of the substrate, thereby improving both alignment accuracy and operational efficiency.
Solution Approach 2:
The alignment members are designed to be movable rather than fixed, allowing dynamic adjustment during the alignment process. The ability to move alignment members close to or away from the substrate enables real-time positioning adjustments, significantly improving alignment efficiency without compromising accuracy.
2Manufacturing precision
If alignment members move vertically relative to the supporting surface, then positioning can be achieved, but the mechanism complexity increases
Solution Approach 1:
The invention extracts the essential alignment function from complex vertical movement mechanisms and implements it through simpler horizontal movement. By removing the need for vertical movement, the mechanism complexity is reduced while maintaining positioning accuracy through the coordinated action of multiple alignment members moving parallel to the supporting surface.
Solution Approach 2:
Instead of moving alignment members vertically toward the substrate for positioning, the invention inverts the approach by moving them horizontally parallel to the supporting surface. This inverted movement direction simplifies the mechanism while achieving the same positioning objective through a different kinematic approach.
3Measurement precision
If multiple detectors are installed on the machine, then alignment detection capability is improved, but the installation cost increases
Solution Approach 1:
The alignment members are designed to provide self-alignment capabilities through their mechanical structure and movement characteristics. The system uses the physical interactions between alignment members and substrates (such as contact and support functions) to achieve alignment without requiring additional external detectors, thereby maintaining measurement capability while reducing installation costs.
Data Source
AI summary
An alignment mechanism of a bonding machine includes a support pedestal, three first alignment members, and three second alignment members. The support pedestal includes a supporting surface having a placement area for supporting a first substrate, and the first and second alignment members are arranged around the placement area. The first alignment members each include a protruding part and a base. The protruding part is used in supporting a second substrate, and protrudes from the base and directed to the placement area. The base is used to position the first substrate. The second alignment members position the second substrate to align the first and second substrates and facilitate the bonding of the first and second substrates.