Bonding Material Syringe with Compressed Air Control
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Solution Overview
Problem
Existing bonding material applying apparatuses waste bonding material during the stabilization of discharge amount and require additional wasteful discharging stations, complicating the application process and leading to inefficient material consumption.
Innovation Solution
A bonding material applying apparatus with a syringe and compressed air supply mechanism that adjusts air pressure and supply time to prevent wasteful discharge, ensuring the bonding material is not discharged during intervals, maintaining the filled state for reliable application without the need for a wasteful applying station.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If compressed air is supplied continuously to stabilize discharge amount, then discharge stability is improved, but bonding material is wastefully discharged
Solution Approach 1:
The patent implements periodic action by controlling the compressed air supply mechanism to provide brief intermittent air bursts rather than continuous supply. The control unit triggers air supply only when needed to maintain discharge stability, allowing the viscous fluid to settle between pulses. This periodic intervention prevents continuous wasteful discharge while ensuring stable bonding material application when required.
2Reliability
If a separate wasteful discharging station is provided, then discharge stabilization is achieved, but device complexity increases
Solution Approach 1:
The patent merges the discharge stabilization function with the main application station by integrating a control unit that manages compressed air supply timing. Instead of providing a separate wasteful discharging station, the control unit coordinates air supply to the same discharge nozzle used for bonding material application. This integration eliminates the need for additional stations while achieving discharge stabilization through intelligent control of the existing components.
3Reliability
If discharge nozzle moves to wasteful discharging station, then fluid stabilization is achieved, but application process becomes complicated
Solution Approach 1:
The patent extracts the stabilization control function from the physical location of a separate wasteful discharging station and places it within the control unit. The control unit monitors discharge characteristics and triggers brief compressed air supplies to stabilize the viscous fluid without requiring the discharge nozzle to physically move to a different station. This extraction of the stabilization function simplifies the application process by eliminating nozzle relocation while maintaining fluid stabilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for reliable application of a predetermined bonding material amount, reducing wastage and apparatus size by maintaining air pressure and filled state, even after discharge intervals, ensuring efficient and precise application.
Implementation Method 1
a compressed air supply mechanism that supplies compressed air to the syringe and pushes out the bonding material from the discharge nozzle
Implementation Method 2
the bonding material is pushed out to an applying head and is discharged in units of the predetermined amount
Data Source
AI summary
A bonding material applying apparatus includes a syringe in which a bonding material is filled. The syringe includes a discharge nozzle disposed at a tip thereof to discharge the bonding material filled in the syringe. A compressed air supply mechanism supplies compressed air to the syringe and discharges the bonding material from the discharge nozzle. When a discharge interval from the end of discharge to the start of discharge of the bonding material lasts for a certain time or longer, the compressed air supply mechanism supplies the compressed air for a time, which is shorter than a discharge time necessary to discharge the bonding material, to such an extent that the bonding material is substantially not discharged.