Bonding Module Bending for Narrow Bezel Display Panels
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Solution Overview
Problem
Existing display panels face limitations in narrowing the lower bezel due to the existing bending radius, which restricts the screen-to-body ratio and full-screen design in electronic products.
Innovation Solution
A display panel design featuring a bonding module with a bonding conductive layer and a display module, where the source-drain conductive layer in the extension area is electrically connected to the bonding conductive layer through a through hole, allowing for a more compact bonding module placement and reduced bezel width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the bonding area is bent to the backside surface of the display panel, then the bonding module can be accommodated, but the lower bezel cannot be further narrowed due to the bending radius constraint
Solution Approach 1:
The patent transitions the bonding module from a planar configuration to a three-dimensional configuration by bending it along a curved trajectory. The bonding module is folded such that part of it extends to the backside surface of the display panel, utilizing the Z-dimension (depth/thickness) to resolve the spatial conflict between accommodating the bonding area and maintaining a narrow bezel width.
Solution Approach 2:
The bonding module is nested within the overall display panel structure by folding it back onto itself. The bonding module occupies both the front surface area (for electrical connection) and the backside volume (for spatial accommodation), effectively nesting the bonding function within the existing panel boundaries without increasing the overall footprint.
2Area of stationary object
If the bonding module is placed on the backside surface, then plane space is saved, but the fan-out traces are subjected to bending stresses that may cause damage
Solution Approach 1:
The patent employs flexible substrate materials and flexible conductive traces that can withstand repeated bending without fracturing. The fan-out traces are designed with appropriate flexibility and mechanical reinforcement to accommodate the bending trajectory while maintaining electrical connectivity, preventing trace damage during the folding process and throughout the product lifecycle.
Solution Approach 2:
The patent incorporates protective measures in advance to prevent trace damage. This includes designing the bending trajectory to avoid sharp corners, using flexible trace materials with high fatigue resistance, and potentially incorporating reinforcement layers or stress-distributing structures that cushion the traces against mechanical stress during bending and throughout operation.
Data Source
AI summary
The present application provides a display panel and a fabrication method thereof. In the display panel, a bonding module covers a display area and an extension area, and a bonding conductive layer of the bonding module is electrically connected to an external driving chip. A display module covers the display area and the extension area, the display module comprises a thin film transistor array structure, and the thin film transistor array structure comprises a source-drain conductive layer. A portion of the source-drain conductive layer in the extension area is electrically connected to the bonding conductive layer by a through hole.