Semiconductor Bonding Motion Control Without Touch Sensors
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Solution Overview
Problem
Semiconductor manufacturing apparatus with multiple transfer devices face complexity and cost issues due to the need for multiple touch sensors, which complicates accurate control and operation, especially in compact modular designs.
Innovation Solution
A semiconductor packaging apparatus that uses a motor, position sensor, and motion control unit with a path planner to generate position-time commands, allowing for touch information-based adjustments to the motion trajectory without the need for touch sensors, enabling precise control and efficient bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If touch sensors are installed on each transfer device to detect touch events, then measurement precision of touch events is improved, but device complexity and cost increase significantly
Solution Approach 1:
The patent extracts the touch detection function from the transfer device itself and relocates it to the motion control unit. Instead of installing touch sensors on each transfer device, the system uses the motor's existing feedback mechanisms (current, voltage, position) to detect touch events. This extraction eliminates the need for additional touch sensors while maintaining detection capability, thereby reducing device complexity and cost.
Solution Approach 2:
The motion control unit is designed to perform multiple functions: it controls motor motion, processes position feedback, and now also detects touch events. By making the motion control unit universal, the system eliminates the need for separate touch sensors on each transfer device, reducing overall apparatus complexity while maintaining precise touch event detection capability.
2Measurement precision
If touch sensors are installed on each transfer device, then touch event detection capability is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the touch detection function from dedicated touch sensors and implements it using the motor control system's existing feedback mechanisms. This extraction eliminates the need to purchase and install expensive touch sensors on each transfer device, significantly reducing manufacturing cost while maintaining touch event detection capability.
Solution Approach 2:
The motor control unit uses its own existing feedback systems (current, voltage, position) to detect touch events, making the system self-sufficient. Instead of requiring external touch sensors, the motion control unit leverages its inherent capabilities to perform touch detection, thereby eliminating additional manufacturing costs.
3Measurement precision
If multiple touch sensors are installed on multiple transfer devices, then touch event detection coverage is improved, but space requirements increase
Solution Approach 1:
The patent extracts the touch detection function from physical touch sensors and implements it through the motor control unit's feedback systems. This extraction eliminates the need for additional physical sensors on each transfer device, freeing up valuable space in compact modular semiconductor manufacturing apparatus while maintaining full touch event detection coverage.
4Measurement precision
If touch sensors are installed on each transfer device, then touch event detection accuracy is improved, but the number of components increases
Solution Approach 1:
The motion control unit is designed to perform multiple functions including motor control, position feedback processing, and touch event detection. By making this single component universal, the system eliminates the need for separate touch sensors on each transfer device, reducing the total number of components while maintaining accurate touch event detection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution eliminates the need for touch sensors, improving manufacturing quality and efficiency by allowing for precise control of bonding processes with reduced complexity and cost, while maintaining high bonding quality and efficiency.
Implementation Method 1
a position sensor for detecting a position of the bonding device at a specific time point and generating a position signal
Implementation Method 2
a motor for driving the bonding device to operate according to a predetermined motion trajectory
Implementation Method 3
a bonding device for bonding a component to a substrate
Data Source
AI summary
In one aspect of the invention, a semiconductor packaging apparatus is provided and comprises: a bonding device for bonding a component to a substrate; a motor for driving the bonding device to operate according to a predetermined motion trajectory; a position sensor for detecting a position of the bonding device at a specific time point and generating a position signal; a motion control unit comprising a path planner for generating a position-time command for the bonding device according to a bonding process requirement, the motion control unit being configured to enable the path planner to update the position-time command based on a touch information between the component and the substrate. In a further aspect of the invention, a control algorithm for the semiconductor packaging apparatus to identify and generate the touch information is also provided, and the process control flow is optimized using the touch information.