Semiconductor Bonding Pad Adjustment Layer for Simpler Hybrid Bonding
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Solution Overview
Problem
The existing hybrid bonding process for semiconductor devices is complex and costly, limiting the integration of smaller devices into a given area while maintaining high performance, miniaturization, and light weight.
Innovation Solution
The introduction of an adjustment layer between the bonding pad and the topmost conductive layer of the interconnection structure in semiconductor devices, which simplifies the bonding process by eliminating the need for bonding vias and allowing for higher flexibility and uniformity, reduces process complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the existing hybrid bonding process is used to stack and bond multiple semiconductor dies, then high performance and large capacity are achieved, but the process complexity increases and process cost becomes relatively high
Solution Approach 1:
The patent extracts and eliminates the bonding via structure from the traditional hybrid bonding process. By removing this complex intermediate structure, the bonding process is simplified while maintaining bonding performance through direct bonding pad contact between semiconductor dies.
Solution Approach 2:
Instead of using bonding vias to connect bonding pads (traditional approach), the patent inverts the approach by enabling direct bonding pad-to-bonding pad contact. This reversal eliminates the via structure and simplifies the bonding process while achieving the same electrical and mechanical connection functions.
2Area of moving object
If the existing hybrid bonding process is used to integrate more devices into a given area, then large capacity and miniaturization are achieved, but the process cost becomes relatively high
Solution Approach 1:
By extracting the bonding via structure from the process, the patent reduces manufacturing steps and material requirements. This elimination directly lowers process cost while maintaining the ability to achieve high integration density through simplified die stacking and bonding operations.
3Reliability
If bonding vias are used in the bonding structure, then electrical connection is achieved, but the device structure becomes more complex
Solution Approach 1:
The patent inverts the traditional bonding structure by eliminating bonding vias and enabling direct bonding pad contact. This reversal achieves electrical connection through the bonding pads themselves, removing the need for additional via structures and significantly simplifying the overall device architecture.
Solution Approach 2:
The patent merges the functions of electrical connection and mechanical bonding into a single bonding pad interface. By combining these functions, the need for separate bonding vias is eliminated, reducing structural complexity while maintaining reliable electrical connection between stacked dies.
Data Source
AI summary
A semiconductor device includes a substrate, a bonding structure and an adjustment layer. A bonding structure is located over the substrate. The adjustment layer is located on a bonding pad of the bonding structure.