Bonding Pad Structure With Dummy Trench Pattern Against Peeling
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Solution Overview
Problem
Existing CMOS image sensors face challenges in achieving efficient miniaturization and integration while maintaining electrical connectivity and structural integrity, particularly in the formation of bonding pads and interconnects, which can lead to peeling and other reliability issues.
Innovation Solution
The formation of a dummy pattern in a trench surrounding the bonding pad, which is insulated from the interconnect by a dielectric layer, enhances the structural integrity and prevents peeling, while maintaining electrical connectivity through a conductive layer that extends into the dielectric layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If miniaturization and integration of CMOS image sensors are pursued, then higher resolution and lower power consumption are achieved, but structural integrity and electrical connectivity of bonding pads deteriorate, leading to peeling and reliability issues
Solution Approach 1:
A dummy pattern is formed in advance around the bonding pad before final assembly, creating a preventive structure that stops peeling before it occurs. This preliminary structural reinforcement allows miniaturization to proceed while maintaining bonding pad reliability.
Solution Approach 2:
The dummy pattern acts as an intermediary element between the bonding pad and surrounding structures, providing mechanical support and stress distribution that prevents peeling while enabling continued miniaturization of the sensor device.
2Reliability
If bonding pads are formed for electrical connectivity, then electrical connections are established, but structural peeling occurs compromising reliability
Solution Approach 1:
The dummy pattern is formed beforehand around the bonding pad to provide structural reinforcement, preventing peeling that would compromise both electrical connectivity and structural integrity. This preliminary structure ensures both reliability aspects are maintained simultaneously.
3Ease of manufacture
If conventional interconnect structures are used, then manufacturing is simplified, but peeling occurs reducing device reliability
Solution Approach 1:
The dummy pattern is formed as part of the existing interconnect structure fabrication process, adding reliability enhancement without requiring completely new manufacturing steps. This maintains ease of manufacture while improving device stability through the added structural support.
Data Source
AI summary
A semiconductor device includes a single-layered dielectric layer, a conductive line, a conductive via and a conductive pad. The conductive line and the conductive via are disposed in the single-layered dielectric layer. The conductive pad is extended into the single-layered dielectric layer to electrically connected to the conductive line.