Semiconductor Die Bonding Pad Module for Routing Complexity
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Solution Overview
Problem
In semiconductor device assemblies, the complex designs required to satisfy routing rules for connecting bonding pads to package components can lead to inefficiencies, particularly in multi-chip modules where many semiconductor dies are arranged, often necessitating re-designs for different applications and failing to optimize wire lengths and distances between adjacent wires.
Innovation Solution
A semiconductor device assembly comprising a first semiconductor die, a second semiconductor die with a bonding pad module, and conductive elements that allow the first semiconductor die to be coupled to a semiconductor package component or another semiconductor die via the bonding pads and conductive elements, enabling flexible design and efficient communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are used to connect bonding pads to package components, then electrical connections are established, but the routing design becomes complex and requires frequent re-designs
Solution Approach 1:
The patent introduces a bonding pad module as an intermediary component between the bonding pads and package components. This bonding pad module contains multiple bonding pads arranged in a specific pattern, serving as a mediator that simplifies the routing design by providing a standardized interface for electrical connections, thereby reducing the complexity of wire routing designs while maintaining reliable electrical connections.
2Adaptability or versatility
If many semiconductor dies are arranged in a package, then functionality is integrated, but routing rules cannot be optimized and wire lengths are not minimized
Solution Approach 1:
The bonding pad module is designed with a universal structure that can be applied across different semiconductor die arrangements and package configurations. The standardized bonding pad module with its specific geometric pattern serves multiple functions: providing electrical connections, facilitating heat dissipation, and enabling flexible routing designs. This universal design allows the same bonding pad module to be used in various multi-chip module configurations, improving routing efficiency without compromising functional integration.
3Reliability
If semiconductor dies are coupled via bonding pads and conductive elements, then communication is enabled, but design flexibility is reduced
Solution Approach 1:
The patent segments the bonding structure into distinct functional components: the bonding pads on the semiconductor die, the bonding pad module as an intermediate structure, and the conductive elements for electrical connections. This segmentation allows each component to be independently optimized and configured. The bonding pad module can be designed with different geometric patterns and arrangements to suit specific application requirements, thereby maintaining design flexibility while ensuring reliable communication through the segmented bonding structure.
Data Source
AI summary
A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.