Bonding Pad Opening Structure for Stronger Electronic Interconnects
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Solution Overview
Problem
The manufacturing process of electronic devices often faces issues with bonding strength between electronic units and substrates, leading to electrical and reliability problems due to inadequate bonding surfaces.
Innovation Solution
An electronic device design featuring a circuit structure with a first metal layer, a first dielectric layer, and a second metal layer, where the first dielectric layer has an opening exposing the second metal layer, and a bonding component is partially disposed in this opening, with specific surface treatments to enhance bonding strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding is used between electronic units and substrates, then manufacturing process is simple, but bonding strength is insufficient leading to electrical and reliability problems
Solution Approach 1:
The patent introduces a vertical height dimension control between the first dielectric layer top surface and the second metal layer top surface (1-15 μm height difference). This dimensional control creates an optimized bonding geometry that enhances bonding strength without requiring complex additional structures, resolving the contradiction between reliability improvement and device complexity.
Solution Approach 2:
The patent applies surface treatments to modify the surface properties of metal layers and dielectric surfaces. By changing surface characteristics (roughness, energy, morphology) through treatment processes, the bonding strength is significantly enhanced without requiring fundamental structural changes, thus improving reliability while maintaining relatively simple device structure.
2Strength
If bonding surfaces are increased to improve bonding strength, then bonding strength improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies surface treatments selectively to specific surfaces that require enhanced bonding (metal layer surfaces and dielectric surfaces). This localized quality enhancement focuses manufacturing efforts on critical bonding interfaces rather than requiring complex modifications throughout the entire device, improving bonding strength while maintaining manufacturing ease.
Solution Approach 2:
Surface treatments are performed in advance on metal layers and dielectric surfaces before final assembly and bonding. This preliminary preparation of bonding surfaces ensures optimal bonding conditions are established beforehand, making the subsequent bonding process more effective and easier to execute without requiring complex real-time adjustments.
3Reliability
If surface treatments are applied to enhance bonding, then bonding strength increases, but manufacturing process complexity increases
Solution Approach 1:
The patent utilizes surface treatment processes that modify physical and chemical parameters of bonding surfaces (surface energy, roughness, composition). These parameter changes are achieved through established treatment techniques that, while adding process steps, do not require fundamentally new equipment or complex process integration, thus improving electrical reliability with manageable process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described design improves electrical reliability by increasing bonding strength and reducing the risk of cracking, thereby enhancing the overall performance and stability of electronic devices.
Implementation Method 1
a first surface treatment is carried out to roughen surfaces of the first metal layer and of the second metal layer
Implementation Method 2
a second surface treatment is carried out to roughen the second metal layer which is exposed
Data Source
AI summary
An electronic device includes an electronic unit, an encapsulation layer surrounding the electronic unit, a circuit structure electrically connected to the electronic unit and a bonding component. The circuit structure includes a first metal layer electrically connected to the electronic unit, a first dielectric layer disposed on the first metal layer and having an opening and a second metal layer disposed in the opening. The bonding component overlaps the second metal layer, and at least partially disposed in the opening. In cross-sectional view, a first height between a first dielectric layer top surface and a first metal layer top surface is greater than a second height between a second metal layer top surface and the first metal layer top surface. A difference between the first height and the second height is greater than or equal to 1 μm and less than or equal to 15 μm.