Bonding Pad Segmentation for Display Device Alignment Tolerance
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Solution Overview
Problem
The miniaturization of display device components leads to increased difficulty in aligning bonding pads, resulting in alignment errors and low product yield during the connection of substrates in display devices.
Innovation Solution
The design includes separate bonding regions on either side of the display region with larger-sized bonding pads, allowing for greater space and tolerance in alignment, enabling effective electrical connection despite potential misalignment during the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the size of bonding pads is increased to improve alignment tolerance, then the alignment error tolerance is improved, but the area occupied by bonding pads increases
Solution Approach 1:
The bonding pads are segmented into multiple groups (first bonding pads connected to odd strip-shaped electrodes, second bonding pads connected to even strip-shaped electrodes) arranged in separate bonding regions. This segmentation allows each bonding pad to be smaller while the distributed arrangement provides cumulative alignment tolerance, resolving the contradiction between small pad size and alignment tolerance.
Solution Approach 2:
The bonding pads are arranged in multiple dimensions including horizontal distribution (odd and even groups on opposite sides) and vertical distribution (multiple rows of strip-shaped electrodes). This multi-dimensional arrangement increases alignment tolerance without requiring each individual pad to be large, thus reducing the total area occupied.
2Area of moving object
If the display device components are miniaturized to improve device integration, then the device compactness is improved, but the alignment difficulty increases
Solution Approach 1:
The bonding structure is segmented into multiple small bonding pads distributed across different bonding regions rather than using fewer large pads. This segmentation enables miniaturization of the overall device while the distributed pattern provides increased alignment tolerance through statistical probability of successful bonding.
Solution Approach 2:
Different regions of the substrate have different bonding pad arrangements - the first bonding region has pads connected to odd strip-shaped electrodes and the second bonding region has pads connected to even strip-shaped electrodes. This local differentiation optimizes alignment tolerance in each region while maintaining overall device compactness.
3Manufacturing precision
If the bonding pads are arranged in separate bonding regions on both sides of the display region, then the alignment error tolerance is improved, but the device structure complexity increases
Solution Approach 1:
The bonding structure is segmented into first and second bonding regions on opposite sides of the display region, with each region containing bonding pads connected to specific strip-shaped electrodes. This segmentation improves alignment tolerance by distributing bonding opportunities while the modular structure makes the complexity manageable and systematic.
Data Source
AI summary
A display device includes an upper substrate, a lower substrate, and a display medium layer. A displaying region, a first bonding region, and a second bonding region are defined in the upper substrate. The first and second boding regions are positioned at two sides of the displaying region. First upper bonding pads and second upper bonding pads are disposed in the first boding region and the second boding region respectively on the bottom surface of the upper substrate. Each first upper boding pad and each second upper boding pad connect with a corresponding odd strip-shaped electrode and a corresponding even strip-shaped electrode in the displaying region respectively. First and second lower bonding pads are disposed on the top surface of the lower substrate, each of which is electrically connected to one corresponding first upper bonding pads or one corresponding second upper bonding pads.