Bonding Pad Layout for Misalignment-Tolerant Semiconductor Stacking
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Solution Overview
Problem
Semiconductor devices face challenges in maintaining consistent contact area and contact resistance due to misalignment between stacked semiconductor structures, which affects their performance and stability.
Innovation Solution
The semiconductor device design includes a specific arrangement of bonding pads and conductive layers where the centers of the first bonding pads are aligned with intersections formed by virtual straight lines, and the second bonding pads are displaced to overlap different quadrants of the first bonding pads, ensuring a constant total contact area even with misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bonding pads are arranged with centers overlapping at intersections of virtual straight lines, then alignment precision is improved, but manufacturing complexity increases due to the specific geometric arrangement requirements
Solution Approach 1:
The bonding pad arrangement is segmented into a systematic geometric pattern where centers are positioned at intersections of virtual straight lines. This segmentation creates a modular framework that defines precise alignment positions while simplifying the overall design process through standardized spacing and orientation.
Solution Approach 2:
The patent employs asymmetric displacement of bonding pad centers from the exact intersection points of virtual straight lines. By deliberately offsetting the centers along specific directions, the design achieves robust alignment tolerance while maintaining the underlying geometric framework, thus reducing manufacturing complexity without sacrificing precision.
2Reliability
If bonding pads are arranged to maintain constant total contact area with misalignment, then reliability is improved, but device complexity increases due to the specific displacement patterns required
Solution Approach 1:
The patent applies local quality by varying the displacement patterns of individual bonding pads based on their specific positions. Each bonding pad center is displaced according to its local geometric context (which quadrant it lies in), creating a tailored arrangement that maintains constant total contact area while simplifying the overall design through position-dependent rules rather than complex global constraints.
Solution Approach 2:
The invention changes the positional parameters of bonding pad centers from fixed intersection points to displaced positions along specific directions. By adjusting these parameters (displacement distance and direction) based on quadrant location, the design achieves constant contact area stability under misalignment while maintaining a systematic and manufacturable geometric framework.
Data Source
AI summary
A semiconductor device may include: a first semiconductor structure including a first conductive layer and four first bonding pads connected to the first conductive layer; and a second semiconductor structure including a second conductive layer and four second bonding pads connected to the second conductive layer, wherein the four first bonding pads are configured to be disposed to have respective centers each overlapping four intersections that are formed by two virtual first straight lines extending in parallel in a first direction and two virtual second straight lines extending in parallel in a second direction intersecting the first direction, where each of the four first bonding pads has four quadrants divided by the first straight line and the second straight line, and wherein, when the first semiconductor structure and the second semiconductor structure are normally aligned, the four second bonding pads are configured to be disposed to have respective centers that are displaced in directions from the respective centers of the four first bonding pads toward different quadrants.