Bonding Pad and Through-Hole Layout for Thermal Expansion Relief
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Solution Overview
Problem
Electronic devices face reliability and yield issues due to thermal expansion, leading to peeling and warping of layers under bonding pads, which can cause cracking and reduced performance.
Innovation Solution
Incorporating through holes and recesses in the organic layer and conductive layer to accommodate thermal expansion, ensuring the bonding pads and conductive layers have space to expand without causing peeling or warping, and using a specific arrangement of through holes and bonding pads to reduce stress on adjacent layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding pads and conductive layers are made large and continuous to ensure electrical connection, then electrical conductivity is improved, but thermal expansion causes peeling and warping of layers
Solution Approach 1:
The bonding pad is divided into multiple conductive patterns arranged in an array, with through-holes distributed among them. This segmentation allows thermal expansion to be distributed across multiple smaller units rather than causing uniform stress across a large continuous pad, preventing peeling and warping while maintaining electrical connection reliability
Solution Approach 2:
Through-holes are introduced into the organic layer and conductive layer beneath the bonding pad, creating a porous structure that accommodates thermal expansion. These voids allow the material to expand into the empty spaces during temperature changes, reducing stress on the layer interfaces and preventing delamination
2Stability of the object's composition
If through holes are added to accommodate thermal expansion, then layer stability is improved, but device complexity increases
Solution Approach 1:
The through-holes serve dual functions: they accommodate thermal expansion to prevent layer peeling, and they are integrated with the conductive pattern array to maintain electrical connectivity. By combining these functions into a single structural element, the design avoids adding separate components and minimizes overall device complexity
Solution Approach 2:
The through-hole structure performs multiple functions simultaneously: it provides thermal expansion accommodation, maintains mechanical integrity of the organic layer, and is integrated with the conductive network for electrical connection. This multi-functionality reduces the need for additional separate structures, keeping the device design relatively simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces peeling and warping between layers, enhancing the reliability and yield of electronic devices by allowing for thermal expansion without compromising structural integrity.
Implementation Method 1
Incorporating through holes and recesses in the organic layer and conductive layer to accommodate thermal expansion, ensuring the bonding pads and conductive layers have space to expand without causing peeling or warping
Data Source
AI summary
An electronic device includes a substrate, a driving layer, an organic layer and a diode. The driving layer is disposed on the substrate, and the driving layer includes a thin film transistor. The organic layer is disposed on the driving layer, and the organic layer includes a through hole portion. The diode is disposed on the organic layer and overlapped with the through hole portion, the diode is electrically connected to the driving layer by a bonding pad overlapped with the through hole portion, and the diode is not overlapped with the thin film transistor.