Bonding Pad Interconnect Layout to Protect Via Plugs During Probing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Failure of plugs occurs when the interconnect layer including a bonding pad is formed due to damage from contact with a probe needle during examination.
Innovation Solution
The semiconductor device design includes a second insulator region with a higher upper face to prevent excessive pressure on via plugs by positioning the probe needle away from them, and the interconnect layer is structured to minimize damage by ensuring the probe needle contacts this region first, thereby protecting the via plugs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the interconnect layer including bonding pad is disposed on the plug, then the bonding pad can be accessed for probing, but the plug may be damaged when contacted with probe needle
Solution Approach 1:
A protrusion structure is introduced as an intermediary element between the bonding pad and the via plug. This protrusion extends from the lower surface of the interconnect layer toward the via plug, creating a buffer zone that absorbs probing forces before they reach the vulnerable via plug, thus protecting it from damage while maintaining bonding pad accessibility
Solution Approach 2:
The protrusion structure provides beforehand cushioning by being positioned between the bonding pad and via plug prior to any probing operation. When a probe needle contacts the bonding pad, the protrusion absorbs and distributes the mechanical stress, preventing direct transmission of force to the via plug and avoiding cracks or defects
2Measurement precision
If the probe needle contacts the bonding pad directly, then examination can be performed, but excessive pressure may cause cracks in the via plug
Solution Approach 1:
The protrusion acts as a mechanical intermediary that distributes the contact force from the probe needle across a larger area. Instead of concentrating stress at a single point on the via plug, the protrusion structure spreads the load, reducing peak stresses and preventing crack formation during examination operations
Solution Approach 2:
The protrusion structure provides pre-positioned mechanical cushioning that absorbs excessive pressure during probing. By being in place before any examination occurs, it creates a protective buffer that mitigates the impact of probe needle contact forces, allowing examination to proceed without compromising via plug strength
Data Source
AI summary
In one embodiment, a semiconductor device includes a first insulator, a first plug provided in the first insulator, and a first interconnect layer provided on the first insulator. The device further includes a second insulator including a first region that is provided on the first insulator and includes a first upper face, and a second region that is provided on the first interconnect layer and includes a second upper face higher than the first upper face. The device further includes a second interconnect layer including a first portion that is provided on the first insulator and the first plug, a second portion that is provided on the first region, and a third portion that is provided on the second region, the second interconnect layer further including a bonding pad.