Bonding Pad Structure for Stable Semiconductor Wire Bonding
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Solution Overview
Problem
Conventional semiconductor devices face challenges in reliable wire bonding due to the displacement of bonding pad portions during the manufacturing process, which affects the consistency and reliability of electrical connections.
Innovation Solution
The semiconductor device incorporates a bonding pad portion with a recessed first portion that engages with a support structure, preventing accidental displacement and ensuring proper alignment and bonding of wires, thereby enhancing the reliability of wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding pad portion is located above the island portion of the first lead, then the wire bonding can be performed, but the bonding pad portion may be accidentally displaced during the manufacturing process
Solution Approach 1:
The bonding pad portion is preliminarily positioned above the island portion of the first lead during the manufacturing process, before wire bonding occurs. This preliminary positioning ensures that the bonding pad is correctly aligned and prepared for subsequent wire bonding operations, preventing displacement during manufacturing.
Solution Approach 2:
The bonding pad portion acts as an intermediary element between the first lead and the wire. By positioning the bonding pad above the island portion, it serves as a stable intermediate connection point that facilitates reliable wire bonding while maintaining positional accuracy throughout the manufacturing process.
2Reliability
If the bonding pad portion is positioned for wire bonding, then electrical connection can be established, but displacement during manufacturing affects connection consistency
Solution Approach 1:
The bonding pad portion is preliminarily configured in the correct position above the island portion before wire bonding operations. This preliminary action ensures that the bonding pad maintains consistent alignment throughout subsequent manufacturing steps, enabling reliable electrical connections without displacement.
Solution Approach 2:
The bonding pad portion is designed to maintain its position through its inherent structural configuration above the island portion. This self-positioning capability allows the bonding pad to remain stable and aligned during manufacturing processes without requiring additional external positioning mechanisms.
Data Source
AI summary
A semiconductor device includes a semiconductor element, a first lead, a second lead, and a first wire. The bonding-pad reverse surface is offset from the die-pad reverse surface toward the die-pad obverse surface-side in the z direction. The first wire is bonded to the first electrode and the bonding-pad obverse surface. The bonding pad portion includes a single first portion. The first portion is connected to the bonding-pad reverse surface, is surrounded by the bonding-pad reverse surface as viewed in the z direction, and includes a part present at a position different from the bonding-pad reverse surface in the z direction.