Bonding Pad Wire Layout to Prevent Edge Short Circuits
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Solution Overview
Problem
Conductive wires used for bonding devices or semiconductor wafers often bend and protrude, leading to undesired short circuits and reduced device reliability.
Innovation Solution
A bonding structure with a top surface featuring a center region with a higher density of wires and a peripheral region with a lower density or no wires, designed to prevent short circuits by minimizing wire protrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive wires are used for bonding devices or semiconductor wafers, then electrical connection is achieved, but wires easily bend and protrude causing short circuits
Solution Approach 1:
The patent applies local quality by creating different wire density zones within the bonding structure. The center region has high wire density while the peripheral region has low or zero wire density. This spatial differentiation of wire distribution prevents wires from bending and protruding at critical edge areas where short circuits would occur, while maintaining sufficient connectivity in the center region.
Solution Approach 2:
The bonding structure is segmented into distinct regions: a center region with high wire density and peripheral regions with low or no wires. This segmentation allows different functional zones to serve different purposes - the center provides electrical connectivity while the periphery remains clear to prevent wire protrusion and short circuits.
2Reliability
If wire density is increased to improve electrical connection, then connectivity is enhanced, but wire protrusion and short circuit risk increase
Solution Approach 1:
The patent implements local quality by varying wire density across different spatial zones. The center region maintains high wire density to ensure robust electrical connection, while peripheral regions have reduced or zero wire density to eliminate the harmful effect of wire protrusion and potential short circuits.
Solution Approach 2:
The structure is divided into functional segments: a central bonding zone with dense wire distribution for electrical connectivity and peripheral zones with sparse or absent wires to prevent short circuits. This segmentation resolves the contradiction by allowing high connectivity where needed while eliminating hazards where they would occur.
Data Source
AI summary
A bonding structure and a package structure are provided. The bonding structure includes a first pad and a plurality of first wires. The first pad has a top surface including a first region and a second region, wherein the second region is closer to an edge of the top surface of the first pad than the first region is. The first wires are on the top surface of the first pad, wherein a number of the first wires on the first region is greater than a number of the first wires on the second region.