Semiconductor Bonding Pedestal Structure to Prevent Solder Spread
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Solution Overview
Problem
The existing semiconductor devices face issues with excessive wetting and spreading of bonding layers, leading to short circuits between leads, which can occur when the bonding layer connects the semiconductor element to the leads, causing conductive path failures.
Innovation Solution
The semiconductor device incorporates a pedestal portion on the conductive layer with a larger second surface area for the bonding layer to adhere to, reducing overflow and erosion, and a sealing resin that anchors the pedestal portion to prevent peeling, while using a conductive covering layer to enhance bonding strength with the wiring board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrode of the semiconductor element is electrically bonded to one of the first leads, then the length of the conductive path is reduced and parasitic inductance is reduced, but the wetting and spreading of the bonding layer becomes excessive and may reach one of the second leads causing a short circuit
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the bonding layer and the second leads. This resin layer acts as a barrier that prevents the bonding layer from excessively wetting and spreading onto the second leads, thereby avoiding short circuits while maintaining the electrical connection benefits between the semiconductor element and the first leads
Solution Approach 2:
The harmful spreading effect is extracted and contained by introducing a separate resin layer that specifically targets and prevents the bonding layer from reaching the second leads. This separates the functional bonding area from the potentially harmful spreading area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses excessive wetting and spreading of the bonding layer, maintains bonding strength, and prevents peeling, ensuring reliable electrical connections and improved thermal stress distribution.
Implementation Method 1
the wetting and spreading of the bonding layer may become excessive
Data Source
AI summary
A semiconductor device includes: a conductive layer; a semiconductor element including an electrode located on one side in a first direction; and a bonding layer electrically bonding the conductive layer and the semiconductor element. The conductive layer includes an obverse surface facing the semiconductor element in the first direction, and a pedestal portion protruding from the obverse surface. The bonding layer includes a portion located between the pedestal portion and the electrode. The pedestal portion includes a first surface that is an interface with the obverse surface, and a second surface that faces a same side as the obverse surface in the first direction and that is in contact with the bonding layer. An area of the second surface is larger than an area of the first surface. As viewed in the first direction, a periphery of the second surface surrounds the first surface.