Electronic Device Bonding Structure with Organic Polymer Diffusion
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Solution Overview
Problem
The oxidation problem on bonding surfaces in electronic device bonding structures affects bonding strength, and existing methods fail to effectively enhance this strength while maintaining product quality.
Innovation Solution
The formation of organic polymer layers on conductive bonding portions of electronic components, which diffuse into the bonding areas during the bonding process, forming a new compound that improves the die microstructure and enhances bonding strength by changing the columnar microstructure to a refinement die distribution structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional bonding methods are used, then bonding process is simple, but oxidation occurs on bonding surface reducing bonding strength
Solution Approach 1:
The organic polymer layer is formed on the bonding surface before the bonding process occurs. This preliminary protective layer prevents oxidation during bonding by creating a barrier between the bonding surface and oxidizing environment, thereby improving bonding strength while maintaining process simplicity
Solution Approach 2:
The organic polymer layer acts as an intermediary substance between the bonding surfaces. It prevents direct contact between the bonding surface and oxidizing agents, mediating the interaction to prevent harmful oxidation while allowing the bonding process to proceed effectively
2Reliability
If bonding strength is enhanced through material modifications, then product quality improves, but process complexity increases
Solution Approach 1:
The invention changes the chemical composition parameter of the bonding interface by introducing organic polymer layers. This material modification enhances bonding strength and product quality while the process remains relatively simple, avoiding significant increases in process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively improves the oxidation issue on bonding surfaces, increases bonding strength, and ensures favorable product quality by forming organic polymer layers that protect and alter the die microstructure within the conductive bonding portions.
Implementation Method 1
The first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion after the bonding
Implementation Method 2
the first conductive bonding portion and the second conductive bonding portion are metal-to-metal bonding
Data Source
AI summary
A fabrication method of an electronic device bonding structure includes the following steps. A first electronic component including a first conductive bonding portion is provided. A second electronic component including a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. Bonding is performed on the first electronic component and the second electronic component through the first conductive bonding portion and the second conductive bonding portion, such that the first electronic component and the second electronic component are electrically connected. The first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion after the bonding. An electronic device bonding structure is also provided.