Bonding Apparatus Push-Up Unit Thermal Resistance Gap
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Solution Overview
Problem
In electronic component bonding, the heat from a hot tool causes the flexible film to melt and stick to the stage, leading to precision issues during delivery, as the tool's heat transfer results in rotation and positional displacement of the semiconductor chip during suctioning, making precise delivery challenging.
Innovation Solution
A bonding apparatus with a push-up unit that applies a force to the electronic component to maintain its posture and separate it from the stage, creating a thermal resistance gap between the tool and the component, allowing for precise delivery while reducing heat influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the tool approaches close to the semiconductor chip for suctioning, then the rotation and positional displacement of the chip is suppressed, but the heat of the tool is transferred to the chip and film causing the film to stick to the delivery unit
Solution Approach 1:
The patent introduces a delivery unit with a film as an intermediary between the tool and the semiconductor chip. The film acts as a thermal barrier that prevents heat transfer from the tool to the chip while still allowing mechanical contact for precise positioning and suctioning. This mediator resolves the contradiction by enabling close contact for precision without direct heat transfer to the sensitive components.
Solution Approach 2:
The patent segments the contact interface into multiple functional layers: the tool contact surface, the film layer, and the chip surface. This segmentation allows each layer to perform its specific function - the tool provides mechanical force, the film provides thermal isolation, and the chip receives precise positioning - thereby resolving the contradiction between heat transfer and precision delivery.
2Object-affected harmful factors
If the distance between the tool and the semiconductor chip is increased to suppress heat transfer, then the film sticking is reduced, but the rotation and positional displacement of the chip increases
Solution Approach 1:
The film on the delivery unit serves as a mediator that enables close contact between the tool and chip without direct heat transfer. The tool contacts the film rather than the chip directly, allowing thermal isolation while maintaining mechanical coupling for precise positioning. This resolves the contradiction by decoupling the thermal and mechanical interaction pathways.
Solution Approach 2:
The patent applies local quality by making the film have different properties at different locations - it provides thermal insulation where heat transfer is problematic while maintaining mechanical compliance where contact and positioning are needed. The film's localized properties enable simultaneous heat blocking and precise mechanical coupling.
3Productivity
If the hot tool holds the electronic component, then the bonding operation can be performed, but the heat of the tool melts the film and causes it to stick to the stage
Solution Approach 1:
The delivery unit film acts as a mediator that protects the stage from heat-induced sticking. By positioning the film between the hot tool and the stage, the system enables hot tool operation for bonding while the film absorbs and isolates the thermal energy, preventing the stage and film from sticking together.
Solution Approach 2:
The patent converts the harmful heat effect into a beneficial thermal barrier function. The film that would normally be vulnerable to heat melting is instead used as a thermal management component, where its phase change or thermal properties create a protective barrier that prevents worse sticking problems at the stage interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-precision delivery of electronic components by minimizing heat transfer from the bonding tool, preventing film sticking and maintaining component orientation, thus improving delivery accuracy and productivity.
Implementation Method 1
a push-up unit which applies, to the electrode surface of the electronic component, a force for separating the electronic component therefrom in a normal direction of the placing surface
Implementation Method 2
a gap is formed between the bonding tool and the electronic component. The gap functions as thermal resistance to heat transfer from the bonding tool to the electronic component
Implementation Method 3
the tool heats the adhesive via the electronic component, while pressing the electronic component against the substrate
Data Source
AI summary
A bonding apparatus bonds a semiconductor die, which has a first mam surface provided with a bump electrode, to a substrate by means of thermo-compression, with a thermo-compression film being interposed therebetween. The bonding apparatus includes: an intermediate stage that has a die placing surface on which the semiconductor die is placed such that the die placing surface faces the first main surface; and a bonding tool which detachably holds a second main surface of the semiconductor die that is placed on the intermediate stage, the second main surface being on the reverse side of the first main surface. The intermediate stage has a push-up mechanism which applies, to the first main surface of the semiconductor die, a force for separating the semiconductor die therefrom in the normal direction of the die placing surface (in a Z-axis direction).