Bonding Resin Patterning Accuracy Adhesion Reliability
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Solution Overview
Problem
Existing electronic devices with photosensitive resins face challenges in achieving both patterning accuracy and adhesion reliability due to insufficient curing and adhesive strength, leading to defects and reduced yield rates during the bonding process of substrates.
Innovation Solution
The use of a bonding resin composed of a photosensitive resin and a bonding reinforcement resin, where the photosensitive resin is patterned and temporarily cured before developing, and the bonding reinforcement resin is applied to enhance adhesion, using a resin with lower viscosity and no photosensitivity to improve bonding strength and prevent wet-spreading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a photosensitive resin is used for bonding substrates, then patterning accuracy can be achieved, but adhesion reliability is insufficient leading to peeling and shape collapse
Solution Approach 1:
The bonding resin is divided into two distinct functional layers: a photosensitive resin layer for patterning accuracy and a bonding reinforcement resin layer for adhesion reliability. This segmentation allows each layer to independently fulfill its specific function without compromising the other, resolving the contradiction between patterning precision and bonding strength
Solution Approach 2:
The invention uses a composite bonding resin structure combining photosensitive resin and bonding reinforcement resin. This composite approach integrates the advantages of both materials - the photosensitive resin provides precise patterning through light exposure, while the bonding reinforcement resin ensures strong adhesion and prevents peeling, thereby achieving both patterning accuracy and adhesion reliability
2Strength
If the photosensitive resin is cured before developing, then adhesion strength improves, but patterning accuracy is compromised due to premature curing
Solution Approach 1:
The bonding reinforcement resin is applied in advance to the substrate before the photosensitive resin is fully cured. This preliminary action ensures that strong adhesion is established early in the process, preventing peeling during subsequent handling and processing, while the photosensitive resin maintains its patterning capability
Solution Approach 2:
The bonding process is segmented into distinct stages with different resins performing different functions at different times. The bonding reinforcement resin provides early adhesion strength, while the photosensitive resin layer is subsequently patterned with high precision, resolving the timing conflict between curing for strength and patterning for accuracy
3Ease of manufacture
If a single bonding resin is used, then the bonding process is simple, but both patterning accuracy and adhesion reliability cannot be achieved simultaneously
Solution Approach 1:
The bonding resin system is segmented into two functional layers with distinct purposes. This segmentation, while adding a layer, actually simplifies the overall process by allowing each layer to be optimized independently - the photosensitive resin for precise patterning and the bonding reinforcement resin for strong adhesion, achieving both precision and reliability simultaneously
Solution Approach 2:
The composite bonding resin structure combines two materials with complementary properties. This composite approach enables the system to achieve both patterning accuracy (from the photosensitive resin) and adhesion reliability (from the bonding reinforcement resin) that a single material cannot provide, while maintaining ease of manufacture through a straightforward multi-layer application process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves both patterning accuracy and adhesion reliability, stabilizing the manufacturing process and improving yield rates while allowing for miniaturization and cost reduction by reinforcing the adhesive strength and preventing peeling or shape collapse.
Implementation Method 1
the photosensitive resin 53 is patterned into a predetermined shape through exposure and developing
Implementation Method 2
a heat treatment (prebaking) is performed before the developing
Data Source
AI summary
A bonding resin that bonds substrates to each other in a state of being spaced with a gap between the substrates is configured by stacking a photosensitive resin and a bonding reinforcement resin which is different from the photosensitive resin, the photosensitive resin is patterned in one substrate, and the bonding reinforcement resin which is stacked on the patterned photosensitive resin has a fillet being a wet-spreading portion or a portion which swells outward from the photosensitive resin.