Semiconductor Bonding Resin Composition for Thermal Conduction Stability
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Solution Overview
Problem
Current heat dissipation adhesive materials for semiconductors exhibit increased viscosity and adhesive strength at room temperature, leading to storage stability issues and reduced embedding characteristics, which hinder the pick-up process and thermal conduction efficiency in electronic devices.
Innovation Solution
A resin composition for bonding semiconductors is developed, comprising a (meth)acrylate-based resin, an epoxy resin, a heat dissipation filler with a specific functional group, and an imidazole-based curing catalyst, which maintains optimal viscosity and adhesive strength while enhancing thermal conduction characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation adhesive material is used to improve thermal conduction, then thermal conduction characteristics are improved, but viscosity increases and adhesive strength increases at room temperature causing storage stability issues
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive material by incorporating specific reactive diluents and curing agents in controlled ratios. This changes the viscosity and reactivity parameters to achieve optimal balance between thermal conduction, storage stability, and bonding performance
Solution Approach 2:
The patent creates a composite adhesive system combining heat dissipation fillers with specially formulated resin components including reactive diluents and curing agents. This composite structure enables simultaneous achievement of thermal conduction, controlled viscosity, and storage stability
2Temperature
If heat dissipation adhesive material is used to improve thermal conduction, then thermal conduction characteristics are improved, but embedding characteristics are reduced
Solution Approach 1:
The patent adjusts the viscosity and reactivity parameters of the adhesive through selective use of reactive diluents and curing agents, enabling proper embedding characteristics while maintaining thermal conduction properties
Solution Approach 2:
The patent creates different functional zones within the adhesive composition - areas with higher filler concentration for thermal conduction and areas with optimized resin content for embedding and bonding, achieving local optimization of properties
3Strength
If adhesive strength is increased to strengthen physical properties, then adhesive strength is improved, but pick-up process cannot be performed
Solution Approach 1:
The patent creates a dynamic adhesive system where the adhesive strength evolves over time - initially lower to allow pick-up operation, then increasing through controlled curing to provide strong bonding. The reactive diluents and curing agents enable this time-dependent property change
Solution Approach 2:
The patent formulates the adhesive with reactive diluents and curing agents that prevent premature curing, allowing the pick-up operation to be performed first, followed by controlled curing to develop full adhesive strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition ensures excellent storage stability, adhesive strength, and improved thermal conduction, facilitating efficient semiconductor bonding and dicing processes while minimizing reactivity and side reactions at room temperature.
Implementation Method 1
a curing catalyst containing an imidazole-based compound and an organic acid compound
Implementation Method 2
a heat dissipation filler in which a functional group represented by the following Chemical Formula 1 is introduced onto the surface thereof
Implementation Method 3
a binder resin containing a (meth)acrylate-based resin and an epoxy resin; a curing agent
Data Source
AI summary
The present invention relates to a resin composition for bonding semiconductors including two types of curing catalyst mixtures together with a heat dissipation filler in which a specific functional group is introduced onto the surface, an adhesive film for semiconductor produced therefrom, a dicing die bonding film and a method for dicing a semiconductor wafer.