Electronic Device Bonding Resistance Detection via Test Loop
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Solution Overview
Problem
Existing electronic devices lack real-time detection capabilities for bonding resistance, which can degrade due to factors like vibration and temperature, leading to undetected bonding degradation.
Innovation Solution
An electronic device with a detection system and test loop that applies a signal to detect bonding resistance by measuring the voltage drop across a test loop connected to the panel and circuit boards, using a detection unit and controller to determine if the bonding resistance is within a normal range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If bonding state is judged by observing indentation or fracture pattern of conductive particles, then bonding state can be roughly judged, but bonding resistance cannot be judged
Solution Approach 1:
The patent replaces the mechanical observation method (visually inspecting indentation or fracture patterns of conductive particles) with an electrical detection system that measures bonding resistance through applied voltage and current measurement, enabling precise quantitative detection of bonding quality
Solution Approach 2:
The patent introduces a test loop with known resistance as an intermediary element in the detection circuit, allowing the detection system to calculate bonding resistance by measuring voltage across the test loop and comparing it with the known test loop resistance, thereby indirectly obtaining bonding resistance values
2Reliability
If bonding degradation is not detected in advance, then device structure remains simple, but bonding degradation cannot be detected leading to potential failures
Solution Approach 1:
The patent implements a feedback mechanism where the detection system continuously monitors bonding resistance and compares it against threshold values, providing real-time feedback on bonding state and enabling timely detection of degradation before it leads to failure
Solution Approach 2:
The patent performs preliminary detection of bonding resistance using the test loop configuration before bonding degradation occurs, allowing early identification of potential issues and preventive maintenance actions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time monitoring and detection of bonding resistance, preventing abnormal bonding states and ensuring proper operation by outputting enable signals or instructions based on detection results.
Implementation Method 1
measuring the voltage drop across a test loop connected to the panel and circuit boards, using a detection unit and controller to determine if the bonding resistance is within a normal range
Data Source
AI summary
An electronic device is provided. The electronic device includes a panel, a detection system, and a test loop. The test loop is electrically connected to the panel and the detection system. The detection system includes a detection unit and a controller. The detection unit detects a signal transmitted by the test loop, and provides a detection result to the controller.