Bonding Station Shutter Access for Inert Atmosphere Throughput
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Solution Overview
Problem
Existing bonding stations face reduced throughput due to the need for maintaining an inert environment, as closable chambers hinder quick access for inserting workpieces and bonding partners, leading to inefficiencies in processing.
Innovation Solution
A processing system with a shutter system and inert gas supply system that allows controlled access and inert atmosphere maintenance, enabling efficient handling of workpiece carriers and attachment of bonding partners while minimizing disturbance to the inert environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a closable chamber is used to maintain inert environment, then oxidation protection is improved, but throughput is reduced due to limited access
Solution Approach 1:
The chamber is segmented into multiple access areas with independent shutter control, allowing selective access to specific regions without compromising the entire chamber's inert atmosphere. This enables multiple bonding operations to occur simultaneously or sequentially at different locations, improving throughput while maintaining oxidation protection.
Solution Approach 2:
The shutter system is made dynamically controllable, allowing the access opening extent and position to be adjusted in real-time based on bonding requirements. Shutters can be opened only when and where needed, minimizing disturbance to the inert atmosphere while enabling quick access for workpiece insertion and removal, thus improving throughput without sacrificing oxidation protection.
2Object-affected harmful factors
If chamber is closed to maintain inert atmosphere, then oxidation protection is improved, but access speed is reduced
Solution Approach 1:
The chamber is divided into multiple independently controllable access areas, each with its own shutter. This segmentation allows only the specific area needing access to be opened, while other areas remain sealed and maintain inert atmosphere. Access speed is improved because only localized shutters need to move rather than the entire chamber.
Solution Approach 2:
The shutter system provides dynamic control over access timing and location. Shutters can be rapidly opened and closed on demand, enabling quick access when needed while maintaining the closed state for oxidation protection during bonding operations. The dynamic adjustment of access opening position and extent optimizes both access speed and atmosphere protection.
3Ease of operation
If access opening is enlarged for bonding partner insertion, then ease of operation is improved, but inert atmosphere disturbance increases
Solution Approach 1:
The access area is segmented into multiple independently controllable regions. The shutter system can open only the specific segment needed for bonding partner insertion, rather than opening the entire access area. This localized approach facilitates ease of operation for the required task while minimizing the volume of inert atmosphere that becomes disturbed.
Solution Approach 2:
The shutter system dynamically adjusts the access opening position and extent to match the precise requirements of each bonding operation. The opening can be optimized to be just large enough for bonding partner insertion, balancing ease of operation with minimal inert atmosphere disturbance. The dynamic control allows the opening to be adjusted in real-time based on the specific bonding task at hand.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system maintains an inert atmosphere effectively, allowing high throughput by facilitating quick and easy access for bonding operations, thus enhancing processing efficiency.
Implementation Method 1
an inert gas supply system for supplying an inert gas, in particular nitrogen, into a space of the main process section between the bonding partner access area and a main process section part of the workpiece carrier support
Data Source
Figure 1
Figure 2(a)~2(b)
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AI summary
The invention relates to a processing system for handling a workpiece carrier equipped with a workpiece, wherein the processing system is configured to interact with a bonding system for attaching a bonding partner to the workpiece, wherein the processing system comprises a workpiece carrier support for holding and transporting the workpiece carrier through the processing system. The processing system comprises a main process section with a shutter system, with the shutter system being able to at least partially, and in particular fully, cover a bonding partner access area to the main process section, wherein through the bonding partner access area the bonding partner is insertable by the bonding system into the main process section, wherein the bonding partner access area comprises a first access area direction and a second access area direction orthogonal to the first access area direction, with a partial cover provided by the shutter system providing an access opening in the bonding partner access area, wherein the shutter system is able to adapt an access opening position and/or an access opening extent of the access opening at least along one of (i) the first access area direction and (ii) the second access area direction. The main process section further comprises an inert gas supply system for supplying an inert gas, in particular nitrogen, into a space of the main process section between the bonding partner access area and a main process section part of the workpiece carrier support. The invention also relates to a method for handling a workpiece carrier equipped with a workpiece in the processing system and to a computer program product.