Bonding Stage Air Distribution for Thermal Control
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Solution Overview
Problem
Conventional wire bonding systems experience temperature inconsistencies in the bonding stage due to proximity to heat sources, leading to thermal expansion and contraction, which cause inaccuracies in bonding operations.
Innovation Solution
A bonding apparatus with an air distribution system and air inlet that uses compressed air to dynamically control temperature across multiple surfaces of the bonding stage, employing thermocouples for feedback to inject hot or cold air as needed to maintain consistent temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the bonding stage is positioned close to the heater block for efficient heating, then the heating efficiency is improved, but thermal expansion and temperature instability occur
Solution Approach 1:
The patent introduces air as an intermediary cooling medium that is directed onto the bonding stage components (optics system and transducer) to prevent them from absorbing excessive heat from the heater block. This mediator allows the stage to be positioned close to the heater for efficient heating while actively managing the thermal environment of sensitive components to maintain bonding precision.
2Temperature
If a heater is coupled to the bonding stage for temperature control, then the temperature can be raised, but thermal gradients and stress build up due to localized heating
Solution Approach 1:
The patent extracts the heating function from the bonding stage structure itself and separates it from the cooling function. Instead of using an integrated heater that creates localized thermal gradients, the system uses the ambient heater block for heating while applying active cooling directly to the bonding stage components. This separation allows temperature control without building thermal stress within the stage structure.
3Temperature
If natural air cooling is used to lower the bonding stage temperature, then the cooling process is simple, but the cooling rate is slow and insufficient for dynamic temperature control
Solution Approach 1:
The patent transforms the static, passive air cooling process into a dynamic, active cooling system. By introducing a controllable air supply mechanism that can deliver cooled air at regulated flow rates directly to the bonding stage components, the system achieves rapid and adjustable cooling rates. This dynamic approach enables real-time temperature control to match the varying thermal conditions during bonding operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures uniform temperature distribution, reduces thermal stress, and maintains thermal stability, resulting in improved bonding accuracy by allowing precise control of heating and cooling rates.
Implementation Method 1
the air distribution system is operative to pass the air over multiple surfaces of the bonding stage
Implementation Method 2
Heat 24 is generated by the heater block 22 and such heat 24 dissipates to the surrounding ambient air
Implementation Method 3
Heat 24 is generated by the heater block 22 and such heat 24 dissipates to the surrounding ambient air
Implementation Method 4
The heat 24 may be absorbed by the bonding stage 12, optics system 14 and the transducer 18 due to their proximity to the heater block 22
Implementation Method 5
the heat 24 may cause the bonding stage 12, optics system 14 and transducer 18 to expand
Data Source
AI summary
A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution system. The air distribution system is connected to the air inlet for receiving air from the air inlet, and is operative to pass the air over multiple surfaces of the bonding stage for the purpose of temperature control.