Bonding Stage Deflection Control via Connecting Plates
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Solution Overview
Problem
Conventional semiconductor device manufacturing apparatuses face issues with bonding stage deflection due to thermal expansion, leading to degraded flatness and impaired mounting quality, as existing techniques only correct parallelism rather than prevent deflection.
Innovation Solution
The apparatus incorporates connecting members, specifically deflectable connecting plates, that allow the bonding stage to expand and contract in the plane direction while maintaining connection to the base portion, reducing deflection and heat transfer, and includes a tilt adjusting mechanism to ensure precise alignment and thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bonding stage is firmly fixed to the base portion, then the bonding stage maintains structural support, but the bonding stage deflects due to thermal expansion difference causing flatness degradation
Solution Approach 1:
The bonding stage is divided into a stage body and a separate flatness adjusting mechanism. The flatness adjusting mechanism includes adjusting members positioned at multiple locations that can independently adjust the flatness of the stage body, allowing the stage to maintain structural integrity while compensating for thermal expansion-induced deflection.
Solution Approach 2:
The patent introduces adjustable parameters through the flatness adjusting mechanism, which can modify the physical state of the bonding stage by changing the position of the stage body relative to the base portion. This allows dynamic adjustment of flatness in response to thermal expansion, transforming a static fixed structure into a dynamically adjustable system.
2Temperature
If the bonding stage is heated to melt solder or adhesive, then bonding joining is enabled, but the bonding stage deflects due to thermal expansion causing distance variation and degraded mounting quality
Solution Approach 1:
The flatness adjusting mechanism is activated in advance to adjust the flatness of the bonding stage before heating begins. By pre-adjusting the stage flatness, the system compensates for expected thermal expansion effects, ensuring that even as temperature increases and the stage expands, the mounting precision is maintained throughout the bonding process.
Solution Approach 2:
The system incorporates a feedback mechanism where the flatness of the bonding stage is monitored and adjusted in response to thermal conditions. The flatness adjusting mechanism responds to changes in stage flatness caused by heating, continuously maintaining optimal mounting quality through active compensation rather than passive fixed positioning.
3Manufacturing precision
If conventional correction techniques are used to adjust parallelism, then parallelism between bonding stage and bonding head is improved, but the techniques only correct rather than suppress deflection occurrence
Solution Approach 1:
Instead of correcting parallelism after deflection occurs, the flatness adjusting mechanism performs preliminary adjustment of the bonding stage flatness before heating and bonding operations begin. This proactive approach prevents deflection-related parallelism issues from developing in the first place, rather than merely correcting them after the fact.
Solution Approach 2:
The patent transforms the static bonding stage structure into a dynamic system with adjustable flatness. The flatness adjusting mechanism allows the stage to adapt its configuration in response to thermal conditions, enabling the system to maintain parallelism dynamically throughout the heating and bonding process rather than relying on fixed pre-adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses bonding stage deflection, maintains flatness, and enhances bonding quality by allowing thermal expansion while preventing heat loss and ensuring rapid temperature stabilization.
Implementation Method 1
at least one of the one or more connecting members is a connecting plate which deflects following expansion and contraction of the bonding stage in a plane direction caused by a temperature change
Data Source
AI summary
An apparatus for manufacturing a semiconductor device includes a base portion, a bonding stage arranged on the base portion and having a placement surface for placing a substrate; and one or more connecting members which connect the base portion and the bonding stage, wherein at least one of the one or more connecting members is a connecting plate that deflects following the expansion and contraction of the bonding stage in the plane direction caused by a temperature change.