Semiconductor Bonding Stress Correction for Warpage
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Solution Overview
Problem
Semiconductor substrate warpage and distortion lead to pattern misalignment during bonding, which cannot be corrected by mere positional alignment or rotation, resulting in inconsistent magnification components between substrates.
Innovation Solution
A bonding apparatus that calculates a corrected magnification value based on the flatness of the substrates using a relational expression derived from learning substrates, applying stress to deform the substrate and align patterns accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If positional alignment and rotation correction are applied to semiconductor substrates, then alignment accuracy is improved, but pattern misalignment due to magnification differences caused by warpage and distortion remains unresolved
Solution Approach 1:
The patent applies magnification correction by changing the magnification parameter of the substrate image based on detected warpage and distortion. The correction information calculation unit calculates corrected magnification values and applies them to adjust the substrate image, thereby compensating for pattern misalignment caused by substrate deformation.
2Ease of operation
If substrate warpage and distortion are present, then substrate handling becomes easier, but magnification changes cause pattern misalignment that cannot be corrected by positional adjustment
Solution Approach 1:
The patent uses a feedback mechanism where the substrate image is detected by an imaging device, warpage and distortion are calculated from the detected image, and correction information is generated based on these calculations. The corrected substrate image is then used for alignment, creating a closed-loop system that compensates for substrate deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces pattern misalignment by applying the appropriate stress to correct magnification differences, ensuring precise alignment and electrical connection of semiconductor substrates during bonding.
Implementation Method 1
a stress application portion that applies a stress to the first substrate based on the first magnification value
Data Source
AI summary
An apparatus includes a first and second stages. The first and second stages respectively hold a first and second substrates. The second stage being opposed to the first stage. A stress application portion applies a stress to the first substrate based on a first magnification value. A calculator calculates the first magnification value based on a flatness of the first substrate and a first equation. The first equation represents a relation between flatness of a third substrate, a second magnification value, and an amount of pattern misalignment between the third substrate and a fourth substrate bonded to the third substrate. A controller controls the stress application portion to apply a stress to the first substrate on the first stage based on the first magnification value while the first and second substrates are bonded to each other.