Bonding Structure for Substrate Processing Apparatus

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing substrate processing apparatuses face challenges in preventing leakage of the processing atmosphere at the bonding interface between conductive members, which can lead to uneven temperature distribution, corrosion, and conduction failures.

Innovation Solution

A bonding structure featuring endless sealing grooves and sealing members, along with surface irregularities forming minute gaps that communicate with the outside region, creating an air connecting portion to improve thermal conductivity and prevent atmospheric leakage, while maintaining a vacuum connection to isolate the processing region.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a bonding interface is formed between two conductive members, then the processing container can be constructed from modular components, but leakage of the processing atmosphere occurs at the bonding interface

Engineering Contradiction:

Improvemodular constructionVSAvoidsealing performance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent employs a nested sealing structure where an inner sealing member is placed within a groove on the bonding interface, and an outer sealing member surrounds it. This nested arrangement creates multiple sealing barriers at the bonding interface, preventing atmospheric leakage while maintaining modular construction capability.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent uses flexible sealing members (such as O-rings or elastic sealing elements) that can deform to conform to the bonding interface geometry. These flexible sealing elements are installed in grooves at the bonding interface between conductive members, creating reliable seals that prevent plasma or processing gas leakage while allowing for modular assembly and disassembly.

Inventive Principle:

Principle #30Flexible shells and thin films

2Temperature

If the bonding interface is directly exposed, then thermal conductivity between conductive members is improved, but corrosion occurs at the bonding interface

Engineering Contradiction:

Improvethermal conductivityVSAvoidcorrosion resistance

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies different properties to different regions: the bonding interface has direct metal-to-metal contact for high thermal conductivity, while protective coatings or sealing members are applied only at specific locations (grooves and surfaces) to prevent corrosion. This localized application of protective measures maintains thermal performance while providing corrosion protection where needed.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The bonding interface structure combines conductive materials (for thermal conductivity) with protective materials (coatings or sealing members for corrosion resistance). The composite structure allows the metal surfaces to maintain direct contact for heat transfer while protective layers prevent corrosive plasma or processing gases from attacking the metal surfaces.

Inventive Principle:

Principle #40Composite materials

3Reliability

If sealing members are added to the bonding interface, then atmospheric leakage is suppressed, but device complexity increases

Engineering Contradiction:

Improvesealing performanceVSAvoidbonding structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The sealing function is segmented into distinct components: grooves formed on the bonding surfaces, inner sealing members placed in these grooves, and outer sealing members surrounding the inner ones. This segmentation allows each component to perform its specific function efficiently while maintaining a relatively simple overall structure that can be manufactured and assembled using standard techniques.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses atmospheric leakage, prevents corrosion, and enhances thermal conductivity between conductive members, thereby ensuring reliable substrate processing and preventing conduction failures.

Implementation Method 1

gaps formed by surface irregularities of the bonding interface between the first sealing groove and the second sealing groove that communicate with the outside region

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a first sealing member fitted in the first sealing groove and a second sealing member fitted in the second sealing groove; and gaps formed by surface irregularities of the bonding interface

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS11721529B2Bonding structure and bonding method for bonding first conductive member and second conductive member, and substrate processing apparatus

Publication Date: 2023.08.08 TOKYO ELECTRON LTD

AI summary

A bonding structure for bonding a first conductive member and a second conductive member forming a processing container having therein a processing region for processing a substrate is provided. The processing region is isolated from an outside region. In the bonding structure, a bonding interface is formed between the first conductive member and the second conductive member, an endless first sealing groove and an endless second sealing groove face the bonding interface while being separated from each other, a first sealing member is fitted in the first sealing groove and a second sealing member is fitted in the second sealing groove, and gaps formed by surface irregularities of the bonding interface between the first sealing groove and the second sealing groove communicate with the outside region.