Bonding Substrate Surface Activation for Room-Temperature Joining
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current substrate bonding technologies face limitations, particularly when bonding different materials, as they can result in residual thermal stresses and mechanical damage due to differences in thermal expansion coefficients, and require high-vacuum environments, making them unsuitable for components with low heat resistance and complicating the bonding process.
Innovation Solution
A method and apparatus for fabricating a bonding substrate with a surface treatment process involving energetic particle irradiation followed by metal particle irradiation, allowing for sufficient bonding strength at non-high vacuum conditions, and enabling flexible arrangement of bonding mechanisms and process chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heat treatment bonding is used to bond substrates, then bonding strength is improved, but residual thermal stresses and mechanical damage occur due to differences in thermal expansion coefficients
Solution Approach 1:
The invention changes the bonding temperature parameter from high temperature (heat treatment) to room temperature, thereby eliminating thermal expansion differences and residual stresses while maintaining bonding strength through surface activation treatment
Solution Approach 2:
The invention replaces the thermal field (heat treatment) with a chemical field (surface activation treatment), substituting thermal bonding mechanism with chemical bonding mechanism to achieve strong bonding without thermal damage
2Strength
If heat treatment bonding is used, then bonding strength is improved, but application to materials with low heat resistance is limited
Solution Approach 1:
The invention changes the bonding temperature parameter from high temperature to room temperature, enabling bonding of heat-sensitive materials while maintaining strong bonding strength through surface activation
3Adaptability or versatility
If room temperature bonding with particle beam surface activation is used, then bonding applicability is improved, but high vacuum environment and complex bonding mechanism are required
Solution Approach 1:
The invention extracts the surface activation treatment from the vacuum bonding system, allowing surface activation to be performed separately and enabling bonding in non-vacuum environments, thereby simplifying the overall bonding mechanism
Solution Approach 2:
The invention segments the bonding process into two independent parts: surface activation treatment (which can be performed in air) and bonding process (which can be performed in non-vacuum environment), eliminating the need for complex vacuum systems
4Adaptability or versatility
If room temperature bonding with particle beam surface activation is used, then material versatility is improved, but reoxidation of substrate surface occurs requiring extremely short transition time
Solution Approach 1:
The invention extracts the surface activation treatment from the vacuum bonding sequence, allowing it to be performed independently in air before bonding, thereby eliminating the need for rapid vacuum transition and preventing reoxidation
Solution Approach 2:
The invention performs surface activation treatment as a preliminary action before bonding in a non-vacuum environment, creating a stable activated surface that resists reoxidation and maintains bonding capability without requiring immediate vacuum sealing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves strong bonding capabilities without the need for high-vacuum environments, reducing thermal stresses and mechanical damage, and allows for broader application across various substrate materials, enhancing the efficiency and simplicity of the bonding process.
Implementation Method 1
a first surface treatment step of surface-treating a surface of a substrate by irradiation with radiated particles including energetic particles
Implementation Method 2
a second surface treatment step of surface-treating the substrate surface by irradiation with radiated particles including metal particles
Implementation Method 3
the metal particles are distributed in a base material of a surface layer of the bonding substrate with higher concentration than in the remaining of the bonding substrate
Data Source
Figure 1~2
Figure 3(A)~4
Figure 5(A)~6(C)
AI summary
[Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.