Temperature Control Apparatus for Bonding Surface via Condensation and Evaporation
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Solution Overview
Problem
Existing temperature control systems for bonding apparatuses require separate mechanisms for heating and cooling, and switching between heating and cooling media, which is time-consuming and inefficient.
Innovation Solution
A temperature control apparatus with a first pressure bonding unit and a temperature control fluid supply device that supplies gas to condense on the inner wall, adjusting the surface temperature, and a pressure adjustment device to promote vaporization, allowing rapid heating and cooling without the need for separate heating and cooling fluid supply devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate heating and cooling fluid supply mechanisms are installed, then temperature control capability is improved, but device complexity increases
Solution Approach 1:
The single temperature control fluid supply device serves dual purposes by supplying both heating fluid and cooling fluid to the flow passage, eliminating the need for separate supply mechanisms while maintaining temperature control capability
Solution Approach 2:
The system changes the temperature parameter of the temperature control fluid to switch between heating and cooling modes, allowing one fluid supply device to perform both heating and cooling functions by adjusting fluid temperature
2Adaptability or versatility
If fluid switching mechanism is installed to switch between heating and cooling media, then temperature control flexibility is improved, but device complexity and time consumption increase
Solution Approach 1:
Instead of switching fluids, the system changes the temperature parameter of the same temperature control fluid to achieve both heating and cooling, eliminating the time-consuming switching process
Solution Approach 2:
The invention extracts and eliminates the fluid switching mechanism entirely by using temperature parameter changes of a single fluid type to achieve both heating and cooling functions
3Power
If heating medium is supplied to heat the pressure bonding unit, then heating efficiency is improved, but cooling time increases due to switching requirements
Solution Approach 1:
The system changes the temperature parameter of the temperature control fluid from high temperature (for heating) to low temperature (for cooling), enabling rapid switching between heating and cooling modes without mechanical switching delays
Solution Approach 2:
The temperature control fluid continues to flow through the flow passage without interruption, maintaining continuous heat exchange action while switching between heating and cooling modes through temperature parameter changes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and efficient temperature adjustment of the bonding surfaces, reducing the time required for heating and cooling cycles and improving the joint strength and appearance of the bonded area.
Implementation Method 1
a temperature control fluid supply device which supplies a temperature control fluid in form of gas to the first flow passage in such a manner that the temperature control fluid is condensed on an inner wall surface of the first pressure bonding unit that partitions the first flow passage to adjust the first pressure bonding surface to a first heating temperature
Implementation Method 2
a pressure adjustment device which lowers an internal pressure of the first flow passage to promote vaporization of the temperature control fluid in form of liquid in the first flow passage in such a manner that the first pressure bonding surface is adjusted to a temperature lower than the first heating temperature
Data Source
AI summary
A temperature control apparatus includes: a first pressure bonding unit which includes a first flow passage and a first pressure bonding surface which is to be brought into contact with an object; a temperature control fluid supply device which supplies a temperature control fluid in form of gas to the first flow passage in such a manner that the temperature control fluid is condensed on an inner wall surface of the first pressure bonding unit that partitions the first flow passage to adjust the first pressure bonding surface to a first heating temperature; and a pressure adjustment device which lowers an internal pressure of the first flow passage to promote vaporization of the temperature control fluid in form of liquid in the first flow passage in such a manner that the first pressure bonding surface is adjusted to a temperature lower than the first heating temperature.