Bonding System Footprint Reduction via Merged Processing Stations
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Solution Overview
Problem
Conventional bonding systems have a large footprint, which occupies significant space in clean rooms and is inefficient in terms of space utilization.
Innovation Solution
A bonding system comprising a first processing station with a conveyance region, coating device, heating device, and delivery block, and a second processing station with bonding devices, conveyance region, and delivery block, where the first processing station includes a removal device to manage adhesive application and heating, and the second processing station includes multiple bonding devices for substrate bonding, with a configuration that allows for efficient substrate handling and processing while reducing physical space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional bonding systems are used to bond substrates, then substrate processing and bonding operations can be performed, but the system occupies significant space (large footprint) in clean rooms
Solution Approach 1:
The patent combines multiple processing functions (coating, heating, removal, and bonding operations) into an integrated bonding system with a shared conveyance region. This merging of previously separate processing stations into a unified system reduces the overall footprint while maintaining all necessary substrate processing capabilities and throughput.
Solution Approach 2:
The conveyance region serves multiple functions by accommodating substrates during coating, heating, removal, and bonding operations. This multi-functional design eliminates the need for separate dedicated spaces for each process, thereby reducing the total system footprint while preserving full processing capability.
2Adaptability or versatility
If multiple processing devices are integrated in a conventional bonding system, then comprehensive substrate processing can be achieved, but the device complexity increases
Solution Approach 1:
The system is segmented into distinct functional modules (coating device, heating device, removal device, and bonding devices) that operate within a shared conveyance region. This modular segmentation allows each component to perform its specific function independently while benefiting from the simplified overall system architecture provided by the shared space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described bonding system effectively reduces the footprint by optimizing the layout and functionality of processing stations, enhancing throughput and maintaining efficient substrate processing and bonding operations.
Implementation Method 1
a coating device disposed to be adjacent to the first conveyance region and configured to coat an adhesive on the first substrate
Implementation Method 2
a heating device disposed to be adjacent to the first conveyance region and configured to heat the first substrate coated with the adhesive
Implementation Method 3
a plurality of bonding devices each of which is configured to bond the first substrate to the second substrate
Implementation Method 4
An adhesive is applied on the surface of the substrate to be processed or the supporting substrate, and thus the substrate to be processed and the supporting substrate are pressed as described above to be bonded with each other
Data Source
AI summary
An object of the present disclosure is to reduce a footprint. A bonding system of the present disclosure includes a first processing station, a second processing station, and a carry-in/out station. The first processing station includes a first conveyance region, a coating device, a heating device, and a first delivery block. The second processing station includes a plurality of bonding devices, a second conveyance region, and a second delivery block. Each of the plurality of bonding devices bonds the first substrate to the second substrate. The second conveyance region is a region configured to convey the first substrate and the second substrate to and from the plurality of bonding devices. The second delivery block delivers the first substrate, the second substrate and the superimposed substrate between the first conveyance region and the second conveyance region.