Bonding Tool with Disposable Adhesive Tablets
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Solution Overview
Problem
Existing methods for attaching components to glass or other substrates using adhesives are often impractical, costly, or result in inconsistent bonding due to the need for complex equipment and manual handling of adhesives, especially for users with low part volumes.
Innovation Solution
A bonding tool comprising a loading module, oven module, and adhesive picking station module that automates the heating and adhesive application process, allowing for efficient and consistent attachment of adhesive tablets to bonding parts, which can be operated manually or automatically, ensuring consistent temperature and reducing overheating risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive is applied by dosing with nozzles and spraying, then the application process is easy and inexpensive, but the nozzles require frequent cleaning to maintain consistency and the sprayed adhesive is sticky causing bonding parts to contact other objects inadvertently
Solution Approach 1:
The patent uses disposable adhesive tablets instead of reusable nozzle systems. The tablets are pre-formed adhesive elements that are attached to the bonding part and then activated by heat, eliminating the need for cleaning and maintenance of nozzle systems while maintaining consistent application.
Solution Approach 2:
The patent changes the physical state of the adhesive from liquid (sprayed) to solid tablet form, and then activates it through thermal energy. This parameter change allows the adhesive to be applied cleanly without the stickiness problems of liquid adhesive, while the heat activation ensures consistent bonding properties.
2Reliability
If double-sided tape with release layer is applied to bonding part, then adhesive protection is provided, but the release layer adds an inconvenient removal step and may tear leaving portions behind
Solution Approach 1:
The patent extracts the release layer function entirely from the system by using heat-activated adhesive tablets. The adhesive remains inactive in tablet form until heated, eliminating the need for a release layer and its associated removal step, thereby simplifying the attachment process while maintaining protection.
3Ease of operation
If hot melt guns are used to melt adhesive stick, then the process is relatively easy, but only non-structural adhesives can be used
Solution Approach 1:
The patent uses heat as a parameter change to activate the adhesive tablet. By controlling the thermal energy applied, the system can activate various types of adhesives including structural ones that would not work with hot melt guns, thereby expanding adhesive type selection while maintaining ease of operation.
4Ease of manufacture
If bonding machines are used for on-site adhesive application, then adhesive application is achieved, but the machines are complex to operate and expensive to own and maintain
Solution Approach 1:
The patent uses disposable adhesive tablets that require no complex machinery for application. The tablets are simply attached to the bonding part and then activated by heat, eliminating the need for expensive and complex bonding machines while achieving consistent adhesive application.
Solution Approach 2:
The adhesive tablet is self-contained and self-activating through heat application. The system requires no complex operation or maintenance, as the adhesive does its own work of bonding once activated, making the process suitable for users with low part volumes who cannot justify expensive equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tool provides a cost-effective and efficient solution for bonding parts by ensuring consistent adhesive application and temperature control, making it suitable for users with smaller volumes, reducing the complexity and cost associated with existing bonding machines.
Implementation Method 1
a heating block for heating the bonding part to a predetermined temperature
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A manually operated or automated bonding tool (1) for the attachment of a formed adhesive element to a bonding part is disclosed. The bonding tool (10) includes a loading module (30) in which the bare bonding part is loaded, an oven module (32) in which the bare bonding part is heated, an adhesive picking station module (36) in which the adhesive is attached to the heated bare bonding part, and a part transfer module (34) which advances the bare bonding part sequentially from the loading module (30), through the oven module (32), and to the adhesive picking station module (36). The modules are mounted on a base plate (38).