Ultrasonic Bonding Tool Surface for Burr Suppression in Plate Bonding
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Solution Overview
Problem
In semiconductor device manufacturing, ultrasonic bonding can generate foreign substances like burrs that reduce dielectric strength and cause short circuits due to their wide contact area with conductors, even when oriented in the same direction.
Innovation Solution
A bonding tool with a bonding end portion featuring parallel sides and protrusions on its surface, which vibrates in a specific direction to press against conductive plates, includes a suppression portion to direct foreign substances away from the bonding area, preventing them from adhering to electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ultrasonic bonding is performed by pressing the bonding tool against the conductive plates while vibrating, then bonding is achieved, but foreign substances such as burrs are generated that may cause short circuits
Solution Approach 1:
The patent converts the harmful effect of foreign substance generation into a beneficial outcome by designing the bonding tool to actively discharge foreign substances in a controlled direction. The gaps between protrusions and the suppression portion work together to redirect burrs away from critical areas, transforming the inevitable byproduct of ultrasonic bonding into a managed element that no longer threatens device reliability
Solution Approach 2:
The patent extracts foreign substances from the bonding area by providing discharge paths through gaps between protrusions. The suppression portion acts as a barrier that prevents foreign substances from adhering to electrodes, effectively removing them from harmful positions and isolating them in safe zones where they cannot cause short circuits
2Reliability
If gaps between protrusions are opened in the same direction to discharge foreign substances, then foreign substances are directed away from electrodes, but thread-shaped foreign substances still have wide contact area with conductors
Solution Approach 1:
The patent applies local quality by creating different functional zones on the bonding tool surface. The suppression portion is strategically positioned at specific locations where foreign substances are most likely to adhere, providing localized protection. The gaps between protrusions are also strategically arranged to direct foreign substances away from critical electrode areas, creating zone-based control rather than uniform treatment across the entire surface
3Manufacturing precision
If the bonding tool has multiple protrusions on the end surface, then bonding effectiveness is improved, but foreign substances are generated between the protrusions
Solution Approach 1:
The suppression portion serves as an intermediary element between the protrusions and the external environment. It intercepts foreign substances generated between protrusions and redirects them through controlled gaps, preventing direct contact with electrodes. This mediator structure allows the protrusions to perform their bonding function while the suppression portion manages the harmful byproducts
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the generation and adherence of foreign substances, enhancing the reliability of semiconductor devices by preventing short circuits and maintaining the integrity of the bonding area.
Implementation Method 1
a bonding tool for bonding two conductive plates by pressing the bonding tool against the two conductive plates while vibrating the bonding tool in a direction parallel to the conductive plates
Data Source
AI summary
A bonding tool for bonding two conductive plates in contact with each other by pressing the bonding tool against the two conductive plates while vibrating a bonding end portion thereof in a direction parallel to the conductive plates. The bonding end portion of the bonding tool includes a bonding base having an end surface, the end surface having a protrusion area that has two sides facing and parallel to each other in a first direction that is parallel to the end surface, a plurality of protrusions provided in the protrusion area of the end surface, and a suppression portion provided on the end surface along the two sides of the protrusion area. The bonding end portion is configured to vibrate in the first direction.