Bonding Tool Cooling Apparatus with Rotatable Ground Plate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing method of bonding a semiconductor chip to a substrate using thermosetting resin is inefficient due to the high viscosity of the resin at ordinary temperatures, leading to incomplete hardening and prolonged cooling times of the bonding tool, which affects the bonding process.
Innovation Solution
A bonding tool cooling apparatus with a ground plate and a heat radiation member, supported by a variable direction mechanism, that includes a cooling fan and a heat radiation fin, allowing for efficient heat transfer and rapid cooling of the bonding tool by grounding its front edge surface on the ground plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bonding tool is heated to high temperature for bonding, then the bonding strength is improved, but the cooling time becomes excessively long
Solution Approach 1:
The cooling function is segmented from the bonding tool structure. A separate cooling member with ground plate is introduced to perform the cooling function, allowing the bonding tool to be optimized for heating and bonding while the dedicated cooling member handles heat dissipation.
Solution Approach 2:
The cooling member acts as an intermediary between the heated bonding tool and the cooling fan. It receives heat from the bonding tool through thermal contact at the ground surface and transfers it to the cooling fan, enabling efficient heat transfer without direct exposure of the bonding tool to cooling airflow.
2Productivity
If the bonding tool is cooled rapidly after bonding, then the productivity is improved, but the bonding quality deteriorates due to incomplete resin hardening
Solution Approach 1:
The cooling member is pre-cooled before the bonding operation. This preliminary cooling ensures that when the bonding tool contacts the ground plate, heat transfer begins immediately, enabling rapid cooling without compromising the bonding process that already occurred during heating.
Solution Approach 2:
Cooling is applied locally and selectively. The cooling member with ground plate provides targeted cooling only to the bonding tool's front edge surface that contacts it, while other parts of the bonding tool maintain their temperature. This localized cooling allows rapid heat dissipation from critical areas without affecting the overall bonding quality.
3Device complexity
If a simple cooling structure is used, then the device complexity is reduced, but the cooling efficiency is insufficient
Solution Approach 1:
The cooling member extends in the vertical dimension with a ground plate that provides a large contact surface area. This dimensional extension allows for increased heat transfer area without complicating the horizontal layout, achieving high cooling efficiency through vertical space utilization.
Solution Approach 2:
The cooling member's parameters (surface area, thermal conductivity, mass) are optimized to achieve rapid heat transfer. By adjusting these physical parameters, the cooling efficiency is enhanced without requiring complex mechanical structures or multiple cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces the bonding tool cooling time, thereby shortening the overall bonding process and ensuring proper bonding of the semiconductor chip to the substrate.
Implementation Method 1
heat transfer occurs from the bonding tool to the ground plate when the front edge surface of the bonding tool is grounded on the ground surface
Implementation Method 2
a heat radiation member attached to the ground plate
Implementation Method 3
the bonding tool cooling apparatus includes a cooling fan for cooling the heat radiation fin
Data Source
AI summary
A bonding tool cooling apparatus (10) provided in the vicinity of a bonding stage, including a frame (12); a cooling member (16) including a ground plate (14) having a ground surface (14a) on which a front edge surface of a bonding tool (61) is grounded, and a heat radiation fin (15) attached to an opposite surface of the ground plate (14) to the ground surface (14a), wherein the cooling member (16) is supported on the frame (12) by a support mechanism (200) so that the cooling member (16) is rotatable about two axes, i.e., an X axis extending along the ground surface (14a) and a Y axis extending along the ground surface (14a). Bonding tool cooling time can be thereby reduced.