Bonding Tool Parallelism Calibration via Simultaneous Contact
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Solution Overview
Problem
In semiconductor packaging, achieving precise parallelism between bonding tools and support structures is challenging, particularly in applications like thermocompression bonding, where small variations in solder bond height across the substrate can occur due to misalignment, leading to inconsistent bond quality.
Innovation Solution
A bonding machine with a calibration tool that simultaneously contacts both the bonding tool and the support structure, allowing for precise measurement and adjustment of z-axis height values at multiple locations to ensure parallelism, using a compliant beam portion and spherically shaped contact surfaces to facilitate accurate alignment and adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding methods are used without calibration, then the bonding process can proceed quickly, but the parallelism between bonding tool and support structure varies, leading to inconsistent solder bond heights
Solution Approach 1:
A calibration tool is introduced as an intermediary component between the bonding tool and support structure. This calibration tool includes a contact portion that simultaneously contacts both the bonding tool and support structure, enabling precise measurement and adjustment of parallelism without requiring complex direct measurement systems between the bonding tool and support structure.
Solution Approach 2:
The patent replaces complex optical or electronic parallelism measurement systems with a mechanical calibration approach. The calibration tool uses physical contact and mechanical measurement of z-axis height values to determine parallelism, substituting sophisticated measurement electronics with a simpler mechanical measurement system that achieves the same goal.
2Manufacturing precision
If precise parallelism measurement is implemented, then solder bond height consistency improves, but the calibration process time increases
Solution Approach 1:
The calibration operation is performed in advance before actual bonding operations begin. By establishing the parallelism relationship between the bonding tool and support structure beforehand, the system eliminates the need for repeated measurements during production, thus achieving high precision without continuous time loss.
Solution Approach 2:
The calibration tool is designed to be self-measuring, where the contact portion automatically determines z-axis height values through simultaneous contact with both the bonding tool and support structure. This self-service capability eliminates the need for complex external measurement equipment and manual measurement procedures, reducing calibration time while maintaining accuracy.
Data Source
AI summary
A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.