Bonding Tool Pressure and Temperature Control for Semiconductor Chip Mounting
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Solution Overview
Problem
In semiconductor manufacturing, the use of film assist bonding (FAB) often results in tape wrinkles due to heat from the bonding tool, leading to adhesive resin overflow and contamination issues, which complicates stable bonding and increases the risk of chip peeling or adjacent component contamination.
Innovation Solution
A semiconductor manufacturing apparatus with a bonding tool featuring a chip suction structure and a tape suction structure, which controls pressure and temperature in two steps to minimize tape wrinkles, ensuring consistent bonding and reducing the risk of adhesive resin overflow by maintaining equal pressure and gradually increasing temperature to prevent severe deformation of bump electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat is applied to the bonding tool for bonding the semiconductor chip, then bonding is achieved, but tape wrinkles occur leading to adhesive resin overflow and contamination
Solution Approach 1:
The bonding tool is divided into multiple independent suction structures: a chip suction structure for holding the semiconductor chip and a tape suction structure for holding the tape. This segmentation allows independent control of pressure and temperature application to different regions, enabling the tape to be held flat without wrinkles while applying heat for bonding.
Solution Approach 2:
The patent applies pressure control in two stages: first applying pressure to hold the tape flat against the bonding tool surface, then adjusting pressure during bonding. Temperature is also controlled in two stages - first heating to a lower temperature to prevent tape wrinkles, then increasing to a higher temperature for actual bonding. These parameter changes resolve the contradiction between achieving bonding and preventing tape wrinkles.
2Shape
If pressure is applied to minimize tape wrinkles, then tape flatness is improved, but bump electrodes may deform severely
Solution Approach 1:
The tape suction structure applies pressure to the tape in advance before bonding to ensure the tape is held flat and wrinkle-free. This preliminary action prevents tape wrinkles from forming during the bonding process, while the chip suction structure simultaneously holds the chip to prevent bump electrode deformation. The coordinated preliminary action of both suction structures resolves the contradiction between tape flatness and bump electrode integrity.
3Productivity
If temperature is increased quickly for bonding, then bonding speed is improved, but bump electrodes deform severely
Solution Approach 1:
The bonding process is divided into two periodic stages with different temperature levels. In the first stage, the bonding tool is heated to a lower temperature while the suction structures hold the chip and tape flat. In the second stage, the temperature is increased to the bonding temperature. This periodic temperature control prevents severe bump electrode deformation while maintaining bonding productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances mounting reliability by preventing tape wrinkles and ensuring stable adhesive resin extension beyond the board, reducing the likelihood of chip peeling and contamination, thereby improving the overall bonding process.
Implementation Method 1
a chip suction structure and a tape suction structure, which control pressure and temperature in two steps to minimize tape wrinkles
Data Source
AI summary
According to one embodiment, in a semiconductor manufacturing apparatus, a controller relatively moves a bonding tool and a stage close to each other while causing a semiconductor chip to adhere by suction to a surface via a tape using at least a first suction structure in a first period. In a second period, the controller controls the temperature of the bonding tool to a first target temperature while keeping substantially equal to a target pressure a pressure applied to the semiconductor chip by the bonding tool. In a third period, the controller controls a relative distance between the bonding tool and the stage so that the pressure applied to the semiconductor chip by the bonding tool is kept equal to the target pressure and controls the temperature of the bonding tool to a second target temperature. The second target temperature is higher than the first target temperature.