Bonding Tool Sheet Member for Semiconductor Adhesive Control
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Solution Overview
Problem
The existing bonding technologies face issues with adhesive melting and fume gas contamination during the bonding process of semiconductor dies to substrates, leading to unsatisfactory bonding and tool contamination.
Innovation Solution
A bonding apparatus utilizing a sheet member with air permeability, constrained by sheet constraining parts to prevent thermal deformation and adhesion of molten adhesive, ensuring reliable bonding through thermocompression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding surface is heated to melt the adhesive material for bonding, then the bonding process can be performed, but the sheet member undergoes thermal deformation causing the adhesive to adhere to the bonding tool
Solution Approach 1:
A sheet member is introduced as an intermediary between the bonding tool and the adhesive material. The sheet member is positioned to cover the bonding surface and prevent direct contact between the molten adhesive and the bonding tool, thereby eliminating adhesive adhesion to the tool while allowing the bonding process to proceed
Solution Approach 2:
The sheet member functions as a thin film that conformally covers the bonding surface. This flexible film structure allows it to adapt to the bonding surface geometry while maintaining a barrier between the molten adhesive and the bonding tool, preventing harmful adhesive adhesion
2Reliability
If the adhesive material is heated and compressed during bonding, then bonding can be achieved, but fume gas is generated and contaminates the bonding tool
Solution Approach 1:
The sheet member serves as a barrier between the adhesive material and the bonding tool. During heating and compression, the sheet member prevents fume gases generated from the adhesive from directly contacting and contaminating the bonding tool, while still allowing the bonding process to occur effectively
3Adaptability or versatility
If the sheet member is allowed to deform thermally during heating, then the sheet can accommodate temperature changes, but the bonding surface coverage is compromised allowing adhesive adhesion
Solution Approach 1:
The sheet member is designed as a thin film structure that provides flexibility to accommodate thermal changes while maintaining continuous coverage of the bonding surface. This ensures that even during thermal deformation, the sheet remains in contact with the bonding surface and prevents adhesive adhesion to the tool
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables satisfactory bonding of electronic components to substrates by preventing adhesive adhesion to the bonding tool and reducing fume gas contamination, resulting in improved bonding quality and tool cleanliness.
Implementation Method 1
The bonding surface that holds the electronic component is heated to heat the electronic component in a process for performing bonding
Implementation Method 2
a bonding surface that detachably holds the electronic component through a first portion of a sheet member with air permeability
Data Source
AI summary
A bonding apparatus and a bonding method are provided. The bonding apparatus bonds a semiconductor die to a substrate by thermocompression through an adhesive material. This bonding apparatus is provided with: a bonding tool which has a bonding surface that holds the semiconductor die through a first portion of a tape, and a pair of first tape constraining surfaces that are arranged so as to sandwich the bonding surface and constrain a second portion of the tape: tape constraining mechanisms which have a second tape constraining surface that presses the tape against the first tape constraining surfaces; and a control part which controls the movements of the bonding tool and the tape constraining mechanisms.