Bonding Tool Tilt Alignment Using Vacuum Leakage Feedback
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing bonding systems face challenges in achieving precise parallelism between the bonding tool assembly and the support structure assembly, leading to inefficiencies in processes like thermocompression bonding of semiconductor elements.
Innovation Solution
A method and system that utilizes a vacuum sensor to detect vacuum leakage at the interface between the bonding tool and support structure assemblies, allowing for real-time adjustment of tilt to achieve optimal parallelism, using a tilt profile and distance measurements to ensure accurate alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to determine and adjust parallelism between bonding tool and support structure, then the bonding system can operate, but the parallelism precision is insufficient leading to bonding inefficiencies
Solution Approach 1:
The patent employs a feedback mechanism where vacuum sensors continuously monitor vacuum leakage at the interface between the bonding tool assembly and support structure assembly. This real-time feedback on parallelism deviation triggers automatic tilt adjustments to maintain optimal bonding conditions, thereby resolving the contradiction between precision and productivity
Solution Approach 2:
The patent replaces conventional mechanical measurement and adjustment methods with a sensor-based detection system and automated control system. Vacuum sensors detect parallelism deviations through vacuum leakage patterns, and automated tilt adjustment mechanisms replace manual mechanical adjustment, improving both precision and efficiency
2Reliability
If the bonding tool assembly and support structure assembly are brought into contact without precise alignment, then the system can operate, but vacuum leakage occurs reducing bonding quality
Solution Approach 1:
Vacuum sensors provide real-time feedback on vacuum leakage at the interface between bonding tool and support structure assemblies. This feedback enables continuous monitoring and automatic adjustment of tilt to maintain optimal vacuum conditions, eliminating the harmful vacuum leakage while ensuring reliable bonding quality
Solution Approach 2:
The system performs self-adjustment through automated tilt control based on vacuum sensor feedback. The bonding system automatically detects and corrects its own alignment issues without external intervention, maintaining optimal vacuum conditions and bonding quality through self-service operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the parallelism between the bonding tool and support structure assemblies, reducing vacuum leakage and improving the efficiency and accuracy of semiconductor bonding processes.
Implementation Method 1
sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly
Data Source
AI summary
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a bonding tool assembly for bonding a semiconductor element to a substrate. The bonding system also includes a support structure assembly for supporting the substrate. The bonding system further includes a vacuum sensor for sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly during contact therebetween. The vacuum sensor is also used in connection with a tilt adjustment between the bonding tool assembly and the support structure assembly.