Bonding Measurement for Hidden Substrate Warpage Estimation
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Solution Overview
Problem
Conventional methods for measuring the warpage of semiconductor substrates fail to account for regions with mounted electronic components, preventing the measurement of the lower surface state of these components.
Innovation Solution
A measurement device that measures the component height position and substrate height position at multiple points, estimating the position information of the mount region based on these measurements to determine the state of the lower surface of electronic components, allowing for accurate adjustment of inclination during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a laser beam is guided in parallel along the substrate to measure warpage, then the warpage of the substrate can be measured, but the warpage of the substrate in the region where electronic components are mounted cannot be measured
Solution Approach 1:
The patent uses the non-mount region as an intermediary to infer the state of the mount region. By measuring the substrate height in the non-mount region and comparing it with the component height, the system indirectly estimates the warpage in the mount region where direct measurement is impossible. This mediator approach allows information about the obscured region to be derived from accessible regions.
Solution Approach 2:
The patent creates a virtual copy of the mount region's warpage state by using measurements from the non-mount region and component height data. Instead of directly measuring the mount region, the system reconstructs its warpage characteristics through calculation and estimation based on surrounding measurable data, effectively creating an informational copy of the inaccessible region's state.
2Object-affected harmful factors
If the substrate region with mounted electronic components is not irradiated with the laser beam, then the electronic component is protected, but the warpage of the substrate in that region cannot be measured
Solution Approach 1:
The non-mount region serves as a mediator that provides indirect information about the mount region's warpage. By measuring the substrate height in the non-mount region and using it in conjunction with component height measurements, the system can estimate the mount region warpage without exposing the electronic component to the laser beam.
Solution Approach 2:
The patent replaces direct mechanical/optical measurement of the mount region with an indirect calculation-based approach. Instead of using the laser beam to physically measure the mount region (which could damage the component), the system substitutes this with a computational method that uses measurements from safe regions to derive the desired information.
3Measurement precision
If multiple measurement points are used to measure component height position and substrate height position, then the estimation accuracy of mount region position information is improved, but the measurement time increases
Solution Approach 1:
The patent applies partial action by selectively measuring at specific measurement points rather than uniformly across the entire substrate. By strategically choosing measurement points in the non-mount region and at component locations, the system achieves sufficient estimation accuracy without the excessive time cost of measuring every possible point on the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables estimation of the lower surface state of electronic components, facilitating precise bonding by adjusting the inclination between the component and substrate, thereby improving the bonding process.
Implementation Method 1
the measurement part may measure the component height position by irradiating the upper surface of the electronic component with light and detecting reflected light from the upper surface of the electronic component, and measure the substrate height position by irradiating the non-mount region with light and detecting reflected light from the non-mount region
Data Source
AI summary
The present invention can provide a measurement device, a measurement method, and a bonding system, which enable estimation of the state of the underside of an electronic component mounted on a substrate. A measurement device performs measurements on an electronic component that is mounted on a main surface of a substrate, the measurement device comprising: a measurement part that measures a component height position, which is the height of the upper surface of the electronic component, and a substrate height position, which is the height of a non-mount region of the main surface of the substrate where the electronic component is not mounted; and an estimation part that estimates position information relating to a mount region of the main surface of the substrate where the electronic component is mounted, on the basis of the component height position and the substrate height position as measured by the measurement part.