Bonding Wire Deterioration Detection via Sensing Potential Difference
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Solution Overview
Problem
Conventional semiconductor devices require high current to accurately detect bonding wire deterioration, leading to increased voltage drop and temperature rise, which is inefficient and potentially damaging.
Innovation Solution
A semiconductor device with a voltage sensing unit and deterioration detection unit that utilizes potential differences between conductor patterns to detect bonding wire deterioration without increasing current, using the time derivative of current to enhance detection accuracy and reduce temperature rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high current is passed through the bonding wire to improve detection accuracy, then the voltage change at deterioration increases, but the voltage drop increases proportionally and temperature rises
Solution Approach 1:
The patent introduces a sensing bonding wire as an intermediary element that carries only a small sensing current, separate from the main current path. This mediator allows voltage measurement without requiring high current through the main bonding wire, thus improving detection accuracy while minimizing voltage drop and temperature rise in the power-carrying bonding wire.
Solution Approach 2:
The patent segments the current path into two separate functions: a main bonding wire for carrying high current and a sensing bonding wire for carrying low sensing current. This segmentation allows the detection function to be performed with minimal current, resolving the contradiction between detection accuracy and energy loss in the main power path.
2Measurement precision
If high current is passed through the bonding wire to improve detection accuracy, then the voltage change at deterioration increases, but temperature rise occurs
Solution Approach 1:
The sensing bonding wire acts as an intermediary that enables voltage monitoring with minimal current flow. By using this separate sensing path, the main bonding wire operates at normal operating currents without excessive temperature rise, while still allowing accurate deterioration detection through the sensing wire's voltage measurements.
Solution Approach 2:
The patent divides the monitoring function from the power transmission function by using separate sensing bonding wires. This segmentation ensures that the temperature-sensitive sensing measurements are performed with low current, preventing thermal effects from interfering with both detection accuracy and main power delivery.
3Measurement precision
If a specific sensing bonding wire is used to detect deterioration, then detection capability is improved, but device complexity increases
Solution Approach 1:
The sensing bonding wire serves multiple functions: it acts as both a structural connector (like regular bonding wires) and a sensing element for deterioration detection. By making the sensing wire universal in its application, the patent avoids adding separate dedicated sensing components, thus improving detection capability without significantly increasing device complexity.
Solution Approach 2:
The patent merges the sensing function with the existing bonding wire structure. Instead of adding separate sensing components, the sensing capability is integrated into the bonding wire system itself, allowing deterioration detection while maintaining the simplicity of the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves detection accuracy of bonding wire deterioration while minimizing current flow and temperature rise, allowing for effective monitoring without the need for additional sensing wires.
Implementation Method 1
a voltage sensing unit which is connected to the first conductor pattern and the second conductor pattern to sense a potential difference between the first conductor pattern and the second conductor pattern at the time of switching of the semiconductor die device
Implementation Method 2
sense a potential difference between the first conductor pattern and the second conductor pattern at the time of switching of the semiconductor die device
Data Source
AI summary
A semiconductor device improved in deterioration detection accuracy by using an inductance of a bonding wire. The semiconductor device includes a first conductor pattern formed on the insulating substrate, the main current of the semiconductor die device flowing through the first conductor pattern; a second conductor pattern formed on the insulating substrate for sensing the potential of the surface electrode of the semiconductor die device; a first bonding wire for connecting the surface electrode and the first conductor pattern; and a second bonding wire. Further, there is a voltage sensing unit which is connected to the first conductor pattern and the second conductor pattern to sense a potential difference between the first conductor pattern and the second conductor pattern at the time of switching of the semiconductor die device; and a deterioration detection unit for detecting deterioration of the first bonding wire by using the sensed potential difference.