Bonding-Wire Matching Circuit for Compact Doherty Amplifiers
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Solution Overview
Problem
Existing circuit devices for impedance matching with transistors require a large area due to long transmission lines, leading to increased size, especially when the transmission line is long.
Innovation Solution
The use of bonding wires as internal wiring within the matching circuit, which can be disposed close to or straddle other elements, reduces the required area for impedance matching, allowing for a smaller circuit device even with long transmission lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transmission lines are used for impedance matching in the matching circuit, then impedance matching function is achieved, but the area required on the substrate increases
Solution Approach 1:
The patent changes the physical form of the wiring from planar transmission lines to three-dimensional bonding wires that extend vertically from the substrate surface. This parameter change in wiring configuration allows the same impedance matching function to be achieved with significantly reduced substrate area, as the bonding wires utilize the vertical dimension rather than requiring extensive horizontal space.
Solution Approach 2:
The patent transitions from two-dimensional planar transmission lines on the substrate surface to three-dimensional bonding wires that extend in the vertical dimension. By utilizing the third dimension (height) for signal transmission, the circuit achieves the same electrical length and impedance matching performance without occupying additional substrate area, effectively resolving the area constraint.
2Reliability
If long transmission lines are used for impedance matching, then proper impedance matching is achieved, but the circuit device size increases
Solution Approach 1:
The patent changes the geometric parameters of the wiring structure by replacing planar transmission lines with vertically extending bonding wires. This allows the electrical length required for impedance matching to be achieved through vertical height rather than horizontal length, thereby maintaining proper impedance matching performance while reducing the overall circuit device footprint.
Solution Approach 2:
The patent resolves the volume increase issue by moving the transmission path into the vertical dimension using bonding wires. The same electrical length needed for impedance matching is achieved by extending wires upward from the substrate rather than spreading them out horizontally, thus reducing the circuit device's planar footprint and overall volume.
3Area of stationary object
If bonding wires are used as internal wiring in the matching circuit, then the area for transmission lines is reduced, but wiring complexity increases
Solution Approach 1:
The patent replaces the planar transmission line structure with bonding wire interconnections. This substitution utilizes vertical wire bonds instead of horizontal traces, simplifying the substrate layout and reducing the area required for the matching circuit while maintaining the necessary electrical performance.
Data Source
AI summary
This circuit device is a circuit device for impedance matching with a transistor. The circuit device includes a substrate having a main surface and a matching circuit provided on the main surface and connected to an input terminal or an output terminal of the transistor to perform impedance matching with the transistor. The matching circuit has a bonding wire that serves as an internal wiring of the matching circuit and is completed on the main surface.