Bonding Wire Shielding With Dielectric Coating for EMI Control
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Solution Overview
Problem
Current methods for managing electromagnetic interference in electronic devices with high-frequency signals, such as using metal shielding plates, are costly and provide inadequate protection due to non-specific shielding locations away from electrical connection wires.
Innovation Solution
A method involving the formation of an electrical connection between an electronic chip and a carrier substrate using an electrical connection wire, surrounded by a local dielectric coating and covered by a local conductive shield, which is made by distributing and hardening dielectric and conductive materials using a controlled tool like a dispensing syringe, to create effective electromagnetic protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If metal shielding plates are added to electronic devices to manage electromagnetic interference, then electromagnetic protection is provided, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies local quality by implementing electromagnetic shielding only in specific locations where electrical connection wires are present, rather than using global metal shielding plates. The conductive shield is positioned adjacent to individual wires or groups of wires, providing targeted electromagnetic protection while reducing overall device complexity and manufacturing cost.
Solution Approach 2:
The patent segments the electromagnetic shielding into discrete sections, with conductive shields positioned next to specific electrical connection wires or groups of wires. This segmentation allows the shielding to be implemented locally rather than requiring comprehensive metal shielding plates throughout the entire device, thereby reducing complexity while maintaining protection where needed.
2Object-affected harmful factors
If metal shielding plates are used for electromagnetic interference management, then shielding is provided, but the shielding is non-specific and located away from electrical connection wires, resulting in inadequate protection
Solution Approach 1:
The patent implements local quality by placing conductive shields in immediate proximity to electrical connection wires, ensuring that electromagnetic protection is applied precisely where signals are transmitted. This localized approach provides specific shielding around vulnerable wire segments rather than using distant, non-specific metal plates, thereby improving both protection effectiveness and positioning precision.
Solution Approach 2:
The patent introduces an intermediary dielectric coating between the electrical connection wire and the conductive shield. This dielectric layer serves as a mediator that electrically isolates the wire from the shield while maintaining close physical proximity, enabling effective electromagnetic protection without direct electrical contact. The intermediary allows the shield to be positioned adjacent to the wire with high precision while preventing unwanted electrical interactions.
3Object-affected harmful factors
If metal shielding plates and encapsulation components are positioned and connected to ground, then electromagnetic shielding is achieved, but the manufacturing process becomes costly and complex
Solution Approach 1:
The patent reduces manufacturing cost by implementing electromagnetic shielding locally adjacent to specific electrical connection wires rather than using comprehensive metal shielding plates. The conductive shields can be formed using additive manufacturing or other cost-effective techniques, and the process integrates smoothly with existing wire bonding and encapsulation operations, thereby achieving shielding without significantly increasing manufacturing complexity or cost.
Solution Approach 2:
The patent changes the manufacturing approach by forming conductive shields through additive manufacturing or other modern fabrication techniques rather than traditional metal plate assembly. This parameter change in the manufacturing process enables more cost-effective and flexible implementation of electromagnetic shielding, reducing the need for complex positioning and grounding connections associated with traditional metal shielding plates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides enhanced electromagnetic protection for electrical signals by positioning the conductive shield close to the connection wires and pads, reducing signal attenuation and interference while being more cost-effective and targeted than traditional shielding methods.
Implementation Method 1
producing a local dielectric coating made of a dielectric material, which at least partially surrounds the electrical connection wire and at least partially covers the pads and the junctions; The local dielectric coating may be obtained by distributing a determined amount of the dielectric material in the liquid state and hardening this dielectric material
Implementation Method 2
producing a local conductive shield made of an electrically conductive material, which at least partially covers said local dielectric coating; The local conductive shield may be obtained by distributing a determined amount of an electrically conductive material in the liquid state and hardening this conductive material
Data Source
AI summary
An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.