Bonding Wire Fixing Feature to Prevent Shorts at Chip Corners
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Solution Overview
Problem
Existing semiconductor devices face issues with bonding wires being disposed against the corners of electronic components, leading to increased size and resistance due to the need for longer wires to prevent electrical shorts.
Innovation Solution
Incorporating a fixing feature on the substrate or electronic component that physically separates the bonding wire from the corner of the electronic component, allowing the bonding wire to be shorter and reducing resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding wire is lengthened to prevent it from being disposed against the corner of the electronic component, then electronic shorts are prevented, but the size of the semiconductor device and resistance increase
Solution Approach 1:
A fixing feature is introduced as an intermediary element between the bonding wire and the electronic component corner. This fixing feature physically separates the bonding wire from the corner, preventing electronic shorts without requiring the bonding wire to be lengthened. The fixing feature acts as a mediator that maintains the necessary clearance while allowing the bonding wire to remain at its optimal length.
2Reliability
If the bonding wire is lengthened to prevent it from being disposed against the corner of the electronic component, then electronic shorts are prevented, but the resistance of the bonding wire increases
Solution Approach 1:
The fixing feature serves as a mediator that prevents direct contact between the bonding wire and the electronic component corner, eliminating the need to lengthen the bonding wire. By maintaining the necessary separation through this intermediary structure, the bonding wire can remain at its optimal length, thereby minimizing resistance and energy loss.
3Productivity
If the bonding wire is made shorter to reduce device size and resistance, then manufacturing efficiency improves, but the bonding wire may be disposed against the corner of the electronic component causing electronic shorts
Solution Approach 1:
The fixing feature is introduced as an intermediary structure that enables the use of shorter bonding wires while preventing them from contacting the electronic component corner. This mediator allows the bonding wire to be optimally short for manufacturing efficiency and low resistance, while simultaneously ensuring reliability by preventing electronic shorts through physical separation.
4Length of moving object
If a fixing feature is added to separate the bonding wire from the corner, then bonding wire length is reduced, but device complexity increases
Solution Approach 1:
The fixing feature is merged with the substrate structure, integrating the separation function into the existing device architecture. By combining the fixing feature with the substrate, the patent reduces the need for separate, additional components, thereby minimizing the increase in device complexity while still achieving the goal of reducing bonding wire length.
Data Source
AI summary
The present disclosure provides a method of manufacturing a semiconductor device. The method includes providing a substrate. The method also includes attaching an electronic component to the substrate. The method further includes attaching a fixing feature to an upper surface of the electronic component. In addition, the method includes forming a bonding wire connecting the substrate and the electronic component. The bonding wire is at least partially disposed on the fixing feature.