Bonding Wire Interconnects for IC Design Flexibility
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Solution Overview
Problem
Integrated circuit devices face limitations in electrical performance and design flexibility due to metallic interconnects, and are vulnerable to electrostatic discharge damage from external connections.
Innovation Solution
The use of bonding wires for electrical coupling between internal circuits, combined with an electrostatic discharge protection circuit, replaces traditional interconnect lines, enhancing electrical performance and reducing design constraints while protecting against electrostatic discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metallic interconnect is used for internal electrical transmission, then the connection configuration is determined by photolithographic and etching processes, but the electrical performance and design flexibility are limited
Solution Approach 1:
The patent introduces bonding wires as an intermediary element to replace traditional metallic interconnects for internal electrical transmission. The bonding wires are coupled to internal bonding pads through wire bonding process, serving as a mediator between the external bonding pad and internal circuits, thereby achieving better electrical performance while maintaining manufacturing feasibility
Solution Approach 2:
The patent changes the physical parameters of the connection structure by transitioning from planar metallic interconnects to three-dimensional wire bonding structure. This parameter change includes altering the connection path, length, and cross-sectional area, which directly improves electrical performance and design flexibility without compromising manufacturing capability
2Device complexity
If metallic interconnect is used for internal electrical transmission, then the connection path is fixed by design, but design flexibility is reduced
Solution Approach 1:
The patent introduces dynamic design flexibility by allowing the bonding wire connection path to be independently optimized after substrate fabrication. The wire bonding process enables post-fabrication routing adjustments, making the electrical connection path adaptable and flexible rather than fixed during the rigid photolithographic design phase
3Reliability
If external bonding pad is directly connected to internal bonding pad, then electrical connection is achieved, but the device is vulnerable to electrostatic discharge damage
Solution Approach 1:
The patent implements preliminary protection action by integrating an electrostatic discharge protection circuit between the external bonding pad and the first internal bonding pad before any potential electrostatic discharge can reach the internal circuits. This preliminary protective measure is built into the connection path, ensuring internal circuits are protected from electrostatic damage
Data Source
AI summary
An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit and a second circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically coupled to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically coupled to the second circuit. The second internal bonding pad is electrically coupled to the first internal bonding pad via the bonding wire. The external bonding pad is electrically coupled to the first internal bonding pad.