Bonding Wire Light Shielding in Semiconductor Imaging
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Solution Overview
Problem
Semiconductor apparatuses face image quality degradation due to reflected light from wirings, leading to issues like flare and ghosts, and existing solutions either require additional components or increase the size of the apparatus.
Innovation Solution
The semiconductor apparatus incorporates a bonding wire disposed along the plane of a sheet-like member to prevent reflected light from reaching the light-receiving surface, with a projecting part formed to shield the conductive bonding portion from incident light, allowing for a compact design without additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield member is provided to block reflected light from metal wire bonding portions and metal wires, then image quality is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The harmful function of the metal wire bonding portion and metal wire (reflecting light) is extracted and separated from their original positions. The metal wire bonding portion is pressed into a recess and the metal wire is routed along the plane, removing their light-reflecting capability while preserving their electrical connection function.
Solution Approach 2:
The metal wire bonding portion and metal wire, which originally caused harm by reflecting light, are repositioned to serve a dual function: maintaining electrical connection while acting as light shields. The metal wire bonding portion pressed into the recess and the metal wire along the plane create shielding effects that block reflected light from reaching the light-receiving surface.
2Object-affected harmful factors
If electrode pads are disposed apart from the light-receiving surface to suppress reflected light, then image quality is improved, but the size of the semiconductor apparatus increases
Solution Approach 1:
The solution moves from a two-dimensional planar arrangement to a three-dimensional configuration. The metal wire bonding portion is pressed vertically into a recess, and the metal wire is routed along the plane at a different height level, utilizing the vertical dimension to achieve light shielding without increasing the horizontal footprint of the chip.
3Object-affected harmful factors
If metal wire bonding portions and metal wires are shielded from incident light, then reflected light interference is reduced, but additional manufacturing processes are required
Solution Approach 1:
The wire bonding process is merged with the light shielding function. The same metal wire bonding portion and metal wire that establish electrical connections are also positioned to provide optical shielding, combining two functions into a single integrated solution rather than adding separate shielding components or processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses image degradation while maintaining a small-sized semiconductor apparatus, eliminating the need for additional components and reducing manufacturing costs.
Implementation Method 1
The bonding wire is disposed along the plane of the first sheet-like member in such a manner that reflected light from the bonding wire does not impinge on the light receiving surface
Data Source
AI summary
A semiconductor apparatus includes: a first sheet-like member having a light receiving surface of an imaging device and a first connection terminal disposed thereon, the imaging device generating an image by receiving incident light from a light collecting section for collecting external light disposed thereon; a second sheet-like member having a second connection terminal to be connected to the first connection terminal provided thereon; a conductive bonding portion made of a conductive material and bonded with the first connection terminal; and a bonding wire connecting the conductive bonding portion and the second connection terminal, wherein the bonding wire is disposed along the plane of the first sheet-like member such that reflected light from the bonding wire does not impinge on the light receiving surface.