Bonding Wire Neck Structure for Low-Loop Semiconductor Packaging
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Solution Overview
Problem
The challenge in semiconductor packaging is to reduce the loop height of bonding wires while maintaining a strong and reliable connection structure, which is essential for the miniaturization of electronic devices.
Innovation Solution
A bonding wire configuration with a ball part, a neck part, and a wire part is used, where the wire part is in contact with the neck part, the ball part, and the first pad, and a V-shaped pressed region is formed to decrease the loop height and improve connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the loop height of bonding wire is decreased to enable miniaturization of semiconductor packages, then the size and thickness of semiconductor packages are reduced, but the connection reliability may be compromised
Solution Approach 1:
The bonding wire is segmented into three distinct parts: ball part, neck part, and wire part. Each part serves a specific function - the ball part provides bonding surface, the neck part creates mechanical interlocking through the V-shaped pressed region, and the wire part provides electrical connection. This segmentation allows the loop height to be reduced while maintaining connection reliability through the interlocking mechanism at the neck part.
Solution Approach 2:
The ball part of the bonding wire has a spherical shape that provides a large bonding surface area for reliable connection to the first pad. The curved surface of the ball part ensures optimal contact and bonding strength, allowing reduced loop height without compromising connection reliability.
2Ease of manufacture
If the bonding wire structure is simplified to reduce manufacturing complexity, then the manufacturing process becomes easier, but the connection strength and reliability may be insufficient
Solution Approach 1:
The neck part with V-shaped pressed region is formed during the wire bonding process itself, before final packaging. This preliminary formation of the interlocking structure ensures that the mechanical strength is built-in during manufacturing, maintaining both ease of manufacture and connection strength.
Solution Approach 2:
The bonding wire structure merges multiple functions into a single component: electrical connection, mechanical support, and mechanical interlocking through the V-shaped pressed region. This merging eliminates the need for separate structural elements, simplifying manufacturing while ensuring connection strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively decreases the loop height of the bonding wire, enhances the reliability of the connection structure, and allows for the creation of smaller, lighter, and more integrated semiconductor packages.
Implementation Method 1
a ball part bonded to the first pad
Implementation Method 2
the wire part is in contact with the neck part, the ball part, and the first pad
Data Source
AI summary
A bonding wire for connecting a first pad to a second pad is provided. The bonding wire includes a ball part bonded to the first pad, a neck part formed on the ball part, and a wire part extending from the neck part to the second pad. Less than an entire portion of a top surface of the neck part is covered by the wire part, and the wire part is in contact with the neck part, the ball part, and the first pad.