Bonding Wire Package Structure for Mold Sweep Prevention
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Solution Overview
Problem
The sweep phenomenon during the molding process of semiconductor packages, where bonding wires bend or drop due to the flow of molding material, poses a reliability issue, especially for miniaturized semiconductor chips with thin or long wires.
Innovation Solution
A semiconductor package design incorporating a first dam structure on the package substrate between connection and bonding pads, surrounded by a non-conductive filler and covered by a mold layer, which stabilizes the bonding wires and prevents them from being swept by the molding material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thin or long bonding wires are used to mount miniaturized semiconductor chips, then chip miniaturization is achieved, but the sweep phenomenon becomes more severe causing wire bending or dropping
Solution Approach 1:
The dam structure is formed on the substrate before the bonding wires are mounted. This preliminary structure prevents the molding material from sweeping the wires during the molding process, thereby maintaining wire stability even when thin or long wires are used for miniaturized chips.
Solution Approach 2:
The dam structure acts as an intermediary element between the molding material and the bonding wires. It blocks the flow of molding material from directly contacting and sweeping the wires, thus protecting the wires from bending or dropping while allowing the wires to remain thin and long for chip miniaturization.
2Reliability
If bonding wires are used to connect semiconductor chip and substrate, then electrical connection is established, but the molding material flow causes wire bending or dropping during molding
Solution Approach 1:
The dam structure is formed in advance to counteract the harmful effect of molding material flow. By creating this barrier before molding, the wires are protected from the sweeping force that would otherwise cause them to bend or drop, thereby maintaining their shape and electrical connection reliability.
Solution Approach 2:
The dam structure serves as an intermediary barrier between the molding material and the bonding wires. It intercepts the flowing molding material and prevents it from directly acting on the wires, thus preserving the wires' original shape and ensuring reliable electrical connections.
3Volume of moving object
If thin wires are used for miniaturized chips, then chip size is reduced, but wire positioning consistency deteriorates due to sweep phenomenon
Solution Approach 1:
The dam structure is formed before wire mounting and molding processes. This preliminary barrier ensures that thin wires maintain consistent positioning by preventing the molding material from sweeping them, thereby achieving both chip miniaturization and manufacturing precision.
Solution Approach 2:
The dam structure acts as an intermediary that protects thin wires from the disruptive flow of molding material. This allows wires to be positioned consistently even when used with miniaturized chips, as the dam blocks the sweeping force that would otherwise cause positioning variations.
Data Source
AI summary
A semiconductor package includes a package substrate including a package substrate comprising a base layer and a connection pad disposed on an upper surface of the base layer; a semiconductor chip disposed on the package substrate and the semiconductor chip comprises a semiconductor substrate and a bonding pad disposed on an upper surface of the semiconductor substrate; a bonding wire in contact with the connection pad and the bonding pad; a first dam structure disposed on the package substrate and arranged between the connection pad and the bonding pad; a non-conductive filler disposed on the package substrate surrounding the first dam structure and the bonding wire; and a mold layer disposed on the package substrate covering a portion of an upper surface of the package substrate and surrounding the semiconductor chip and the non-conductive filler.