Bondline Embedded Current Sensor for Lightning Strike Monitoring
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Solution Overview
Problem
Existing methods for monitoring adhesive bonding integrity in structural assemblies are limited by their inability to provide real-time, continuous, and direct measurements, especially in inaccessible locations, and fail to effectively detect and monitor electrical current flow through bonded joints, which is crucial for withstanding high-intensity events like lightning strikes.
Innovation Solution
A system and method that integrate an electrical sensor network within the adhesive layer of bonded structural assemblies, including a scrim ply layer with embedded sensors, which can monitor adhesive integrity and detect electrical current flow through inductive coils, providing real-time data via digital communications networks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external sensors are positioned on the surface of the composite structure, then the structure can be monitored without disassembly, but the measurements are indirect and less accurate for bondline characteristics
Solution Approach 1:
The sensor is embedded within the bondline itself, nesting the measurement device inside the structure being measured. This eliminates the need for external positioning and provides direct, accurate measurements of bondline characteristics from within the adhesive layer.
Solution Approach 2:
The sensor acts as an intermediary element embedded in the bondline that directly measures bondline characteristics. This intermediary position allows the sensor to capture accurate local data without requiring access to external surfaces or complex positioning systems.
2Reliability
If known inspection methods are used to assess bondline integrity, then inspection can be performed, but the hardware must be pulled out of service and inspection is time-consuming
Solution Approach 1:
The embedded sensor enables continuous monitoring of bondline integrity while the structure remains in service. This eliminates the need to pull hardware out of service for inspection, as the sensor continuously provides data on bondline health without interrupting operational functionality.
Solution Approach 2:
The structure performs self-monitoring through the embedded sensor that continuously assesses bondline integrity. This self-service capability eliminates the need for external inspection personnel and equipment, allowing the structure to monitor its own health status in real-time during operation.
3Measurement precision
If visual inspection methods are used, then inspection can be performed, but visual access to interior bonded joints is limited or not possible
Solution Approach 1:
The sensor is nested within the bondline at the exact location where measurements are needed, eliminating the need for visual access to interior bonded joints. This internal positioning allows the sensor to directly measure bondline integrity regardless of whether the location is visually accessible from the exterior.
Solution Approach 2:
The embedded sensor replaces mechanical visual inspection methods with an electrical/electronic measurement system. This substitution allows for bondline integrity detection without requiring physical access or line-of-sight to the bonded joint, as the sensor electronically measures characteristics from within the bondline.
4Loss of information
If periodic inspection is performed instead of continuous monitoring, then inspection costs are reduced, but bondline integrity information is not available in real-time
Solution Approach 1:
The sensor system can operate in periodic measurement cycles rather than truly continuous operation, taking measurements at intervals sufficient to detect bondline degradation while allowing power management between cycles. This periodic action provides real-time capability when needed while reducing overall power consumption.
Solution Approach 2:
The sensor can change its operational parameters dynamically, switching between high-power measurement modes and low-power standby modes. This parameter changing allows the system to provide real-time bondline integrity data when required while consuming minimal energy during normal operation, balancing data availability with power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous, real-time monitoring of adhesive bonding integrity and electrical current flow, reducing maintenance costs and improving the reliability and safety of structural components by detecting potential weaknesses and high-intensity current exposure.
Implementation Method 1
A current sensor network (302) may be embedded in an adhesive layer (52) of the cured bondline (32). The current sensor network (302) may include a plurality of inductive coils (304)... Each one of the inductive coils (304) may have a lengthwise direction oriented generally parallel to the first and second faying surfaces (37, 43)... An electrical current (350) may be passing through the adhesive layer (52)... A magnetic field (352) may be associated with the electrical current (350)
Implementation Method 2
inducing an induced current (306) in the inductive coils (304) in response to the magnetic field (352) associated with electrical current (350) passing through the adhesive layer (52)
Data Source
AI summary
A system for monitoring electrical current passing through a cured bondline may include a current sensor network embedded in an adhesive layer of the cured bondline. The current sensor network may include a plurality of inductive coils and a plurality of current sensor nodes electrically interconnecting the inductive coils to form a plurality of current sensor loops generating induced current in response to a magnetic field associated with an electrical current passing through the adhesive layer. The current sensor nodes may generate current signals representative of the induced current. The current sensor network may include a digital data communications network located external to the cured bondline and receiving the current signals from the current sensor nodes and detecting and monitoring electrical current passing through the cured bondline based on the current signals.