Bondwire Fault Detection Circuit for IC Package Integrity
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Solution Overview
Problem
Existing integrated circuits face challenges in detecting missing or faulty bondwires, which can lead to system-level issues such as radiated immunity, radiated emission, and common mode noise, making it difficult to identify and address these faults effectively.
Innovation Solution
The integration of a bondwire fault detection (BFD) circuit within the integrated circuit (IC) that includes a switch and a switch controller, comprising resistors, capacitors, and buffer circuits, to detect bondwire faults by monitoring current flow and generating a fault signal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional bondwire connection methods are used without detection circuits, then device complexity is reduced, but reliability deteriorates due to undetected bondwire faults causing system-level issues
Solution Approach 1:
The patent merges the bondwire fault detection function with the existing integrated circuit by integrating a detection circuit that shares common components (power supply, ground, bondwires) with the main circuit. The detection circuit is combined with the transmitter circuitry, allowing simultaneous detection and communication functions without adding separate dedicated detection hardware.
Solution Approach 2:
The detection circuit is designed to serve multiple purposes: it can detect bondwire faults, verify package integrity, and work alongside the existing communication transmitter. The same bondwires and electrical connections serve both the primary communication function and the fault detection function, maximizing component utility.
2Loss of information
If bondwire faults are not detected, then manufacturing processes are simplified, but loss of information occurs as system-level issues like radiated immunity and common mode noise cannot be identified
Solution Approach 1:
The integrated circuit performs self-diagnosis by incorporating the detection circuit within itself. The circuit can autonomously monitor its own bondwire connections and generate fault indicators without requiring external testing equipment, enabling the device to report its own health status.
Solution Approach 2:
The detection circuit provides feedback about bondwire integrity to the system. When a fault is detected, the circuit generates a detectable signal or state change that communicates the fault condition back to the system, enabling automated fault identification and reporting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates the detection of missing or faulty bondwires, enabling proper sorting, repair, or disposal of ICs, thereby ensuring functional integrity and reducing system-level noise issues.
Implementation Method 1
The capacitor has a first terminal and a second terminal. The first terminal of the capacitor is coupled to the ground terminal and to the first bondwire terminal. The second terminal of the capacitor is coupled to the second terminals of the first and second resistors.
Data Source
AI summary
A circuit includes a switch and a switch controller. The switch has a first terminal coupled to a voltage supply terminal, a second terminal coupled to a ground terminal and to a first bondwire terminal. The switch controller includes: a first resistor, a second resistor, a capacitor, and a buffer circuit. The first resistor has a first terminal coupled to a second bondwire terminal. The second resistor has a first terminal coupled to the voltage supply terminal and has a second terminal coupled to a second terminal of the first resistor. The capacitor has a first terminal coupled to the ground terminal and to the first bondwire terminal and has a second terminal coupled to second terminals of the first and second resistors. The buffer circuit has a terminal coupled to the second terminal of the capacitor and has an output terminal coupled to the control terminal of the switch.